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Method for grinding back surface of DBC substrate

A back grinding and substrate technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problem of uneven surface height of DBC substrates, improve surface appearance, maintain roughness, and reduce board surface warpage Effect

Inactive Publication Date: 2018-06-08
上海富乐华半导体科技有限公司
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Problems solved by technology

[0005] In order to solve the problem of unevenness on the surface of the DBC substrate, the present invention provides a method for grinding the back of the DBC substrate by adding a mechanical grinding process before applying the heat dissipation coating process, and by selecting a combination of brushes and rollers made of different materials. Grinding and polishing to achieve the purpose of leveling the back of the DBC substrate

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  • Method for grinding back surface of DBC substrate

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Embodiment Construction

[0022] Below in conjunction with accompanying drawing, the present invention will be further described.

[0023] In order to solve the problem that the unevenness of the back of the DBC substrate affects the bonding with the radiator, the invention achieves the purpose of leveling the back of the DBC substrate by adding a mechanical grinding process.

[0024] Specific steps are as follows:

[0025] Step 1. Set up a hard brush roller, and the back of the substrate is ground once by the hard brush roller;

[0026] (1) The speed of the hard brush roller is set to 1.0-2.0m / min;

[0027] (2) The amount of grinding on the back copper surface is controlled within the range of 10um to 30um;

[0028] (3) Hard brush roller mesh: 400~900#; current: 0.4~0.9A;

[0029] Step 2. Set three soft brush rollers, and polish the back of the substrate three times with soft brush rollers;

[0030] (1) The speed of the soft brush roller is set to 1.0-2.0m / min;

[0031] (2) Mesh of soft brush rol...

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Abstract

The invention provides a method for grinding back surface of a DBC substrate, which solves the problem that the surface of a double-sided copper-clad ceramic substrate is uneven; a mechanical grindingprocess is added before a heat dissipation coating process; brush rolls with different materials are selected to be combined; a copper surface on the back surface of the DBC substrate is grinded andpolished so as to achieve the purpose of leveling the back surface of the substrate.

Description

technical field [0001] The invention belongs to the field of DBC substrate manufacturing, and in particular relates to a method for back grinding of a DBC substrate. Background technique [0002] When the double-sided copper-clad ceramic substrate (DBC substrate) is used for power device packaging, components are welded on the front side (circuit side), while the back side (heat dissipation side) is welded to the copper base plate to dissipate the generated heat. Due to the different thermal expansion coefficients of the DBC base plate and the copper base plate, large-area welding leads to welding fatigue, resulting in a decrease in the thermal cycle capability of power devices. In order to improve the thermal cycle capability, a process of coating the back of the DBC substrate with a heat-dissipating coating and bonding it directly to the heat sink is gradually adopted during packaging. However, this packaging process has higher requirements on the surface state of the bac...

Claims

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Application Information

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IPC IPC(8): H01L21/304
CPCH01L21/304
Inventor 周轶靓贺贤汉戴洪兴孔德举
Owner 上海富乐华半导体科技有限公司
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