Periodic-pulse thermal-imagery detection method for leaded steel material debonding defect

A multi-layer material and periodic pulse technology, which is applied in the direction of material defect testing, etc., can solve the problems of long detection time, complex phase-locked modulation system, high hardware cost, etc., and achieve the effect of low hardware cost, improved signal resolution, and simple equipment

Active Publication Date: 2017-12-19
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The existing modulation mode has phase-locked modulation, but the phase-locked modulation system is complicated, the hardware cost is high, and the detection time is long in order to achieve a steady state condition

Method used

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  • Periodic-pulse thermal-imagery detection method for leaded steel material debonding defect
  • Periodic-pulse thermal-imagery detection method for leaded steel material debonding defect
  • Periodic-pulse thermal-imagery detection method for leaded steel material debonding defect

Examples

Experimental program
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Embodiment

[0048] figure 1 Is the block diagram of the periodic pulse thermal imaging system.

[0049] In this example, if figure 1 As shown, the specimen is excited by periodic pulses, and according to the principle of thermal wave conduction, the surface will produce a temperature sequence of periodic changes. The change of surface temperature with time can be expressed as a superposition of two parts: a steady state part and a transient part. Solve the transient distribution of surface temperature T(0,t) according to the principle of thermal wave conduction T and the steady-state distribution T(0,t) S ,as follows:

[0050] T(0,t) T =T am +ΔT(1-e -t / τ )

[0051]

[0052] Since the principle of linear superposition is satisfied, the surface temperature change curve with time is as follows:

[0053] T(0,t)=T(0,t) T +T(0,t) S (5)

[0054] Among them, T(0,t) is the change of surface temperature with time. A is the magnitude of the transient component, q 0 is the total ene...

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Abstract

The invention discloses a periodic pulse thermal imagery detection method for a leaded steel material debonding defect. A part to be tested is excited by periodic pulse to obtain a thermal-imagery sequence of the part to be tested, the thermal-imagery sequence contains defect information, a surface temperature of the thermal-imagery sequence changes along with time, then fourier expansion is performed on the thermal-imagery sequence to be changed into superposition of a plurality of sinusoidal signals, and thermal responses of all the corresponding sinusoidal signals can be obtained according to thermal wave principle; thus, a thermal response of the periodic pulse can be obtained, the purposes of increasing energy and controlling the maximum temperature to rise at the same time can be obtained, a detection depth is improved, a signal resolution ratio is increased, and a detachable rate of deep-layer defects and shallow-layer micro defects is improved.

Description

technical field [0001] The invention belongs to the technical field of non-destructive testing, and more specifically relates to a periodic pulse thermal imaging detection method for debonding defects of lead-steel multilayer materials. Background technique [0002] Non-destructive testing technology is the key technology to ensure the manufacturing quality and operation safety of major engineering equipment. Lead-steel multilayer bonding materials have been widely cited in the field of nuclear industry due to their special structure and properties. Due to the influence of production technology and environmental factors, lead-steel multilayer materials are prone to defects such as poor bonding, pores, and local debonding, which destroys the structural integrity and also poses a huge potential safety hazard. Multilayer materials pose challenges to most nondestructive testing techniques due to their complex structures, commonly possessed thicknesses, diversity of material pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/72
Inventor 高斌李晓希汤光平李建文孙朝明
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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