Light emitting diode chip scale packaging structure
一种发光二极管、芯片级封装的技术,应用在半导体器件、电气元件、电路等方向,能够解决光学不良等问题
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[0061] The embodiments of the summary of the invention provide a LED packaging structure, such as a LED chip-scale packaging structure, a light emitting device including the LED packaging structure, and a manufacturing method thereof. The light-emitting diode packaging structure can provide excellent lighting and display effects.
[0062] It should be noted that the present invention does not show all possible embodiments, and other implementations not presented in the present invention may also be applicable. Furthermore, the size ratios on the drawings are not drawn to the same scale as the actual product. Therefore, the specification and illustrations are only used to describe the embodiments, not to limit the protection scope of the present invention. In addition, the descriptions in the embodiments, such as detailed structures, manufacturing process steps and material applications, etc., are for illustration purposes only, and are not intended to limit the protection sco...
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