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A kind of fpc reinforcing plate and manufacturing method thereof

A manufacturing method and reinforcement board technology, applied in the direction of manufacturing tools, additive manufacturing, manufacturing auxiliary devices, etc., can solve the problem of weakening the overall strength of FPC reinforcement boards, and achieve the effect of improving strength

Active Publication Date: 2020-04-10
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The FPC reinforced board produced by the above method weakens the overall strength of the FPC reinforced board due to the existence of a certain thickness of back glue between the FPC and the reinforced body.

Method used

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  • A kind of fpc reinforcing plate and manufacturing method thereof
  • A kind of fpc reinforcing plate and manufacturing method thereof
  • A kind of fpc reinforcing plate and manufacturing method thereof

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Embodiment Construction

[0014] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] from figure 1 As can be seen from the cross-sectional schematic diagram of the flexible circuit board 10 (referred to as FPC), it generally includes an insulating layer 101 located on the surface layer; a substrate layer 103 located in the middle; and, located between the insulating layer 101 and the substrate layer 103 The signal layer 102. Wherein, the ...

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Abstract

The invention discloses a flexible printed circuit (FPC) reinforcing plate and a manufacturing method thereof. According to the manufacturing method of the FPC reinforcing plate, the strength of the FPC reinforcing plate is improved. The manufacturing method comprises the steps that a three-dimensional digital model of a to-be-printed reinforcing body is obtained; according to the three-dimensional digital model, the to-be-printed reinforcing body is sliced in a layered mode according to the preset layer thickness, and layered data are obtained and input into printing equipment; and the printing equipment fuses and deposits reinforcing materials layer by layer at the to-be-reinforced position of an FPC through a spray head according to the layered data till manufacturing of the FPC reinforcing plate is completed.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to an FPC reinforcing board and a manufacturing method thereof. Background technique [0002] Since the flexible printed circuit (FPC) has the characteristics of high wiring density, light weight, thin thickness, and good bendability, it has been widely used in electronics, automobiles, medical, aerospace and other fields. [0003] In the actual application process of FPC, there are often local strength requirements. At present, the common practice is to use adhesive to fix the reinforcing body to the FPC to achieve the purpose of local strength strengthening. The above operations need to first make the FPC, reinforcing body and back glue; then, by heating and pressurizing, use the back glue to bond the reinforcing body to the FPC to complete the production of the FPC reinforcing board. [0004] In the FPC reinforced board produced by the above method, since the...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C64/118B29C64/386B33Y50/00
Inventor 李奎龙志武王强
Owner VIVO MOBILE COMM CO LTD