Unlock instant, AI-driven research and patent intelligence for your innovation.

Motherboard test circuit and related products

A technology for testing circuits and main boards, applied in the field of communication, can solve problems such as the design not reaching a better state, and achieve the effect of high integration and cost reduction

Active Publication Date: 2021-03-12
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current design is an independent design, and the design has not yet reached a better state

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Motherboard test circuit and related products
  • Motherboard test circuit and related products
  • Motherboard test circuit and related products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] The terms "first", "second", "third" and "fourth" in the description and claims of the present invention and the drawings are used to distinguish different objects, rather than to describe a specific order . Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present disclosure provides a motherboard test circuit and related products, including: a first test point, a second test point, a third test point, a fourth test point, and a switch; wherein, the switch is a dual-channel switch, and the The first test point is connected to the first control port of the switch, the second test point and the third test point are respectively connected to two common ports of the switch, the fourth test point is grounded, A channel of the switch is connected with the UART interface of the central processing unit, and another channel of the switch is connected with the universal serial bus USB of the central processing unit; When the first control port is at a high level, it is connected to the other channel, and when the first control port is at a low level, it is connected to a channel. The technical solution provided by the invention has the advantages of increasing integration and reducing cost.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a motherboard test circuit and related products. Background technique [0002] As the complexity of smart phones increases, the hardware circuit and software design become more and more complex. In the process of development and production, software downloads and various application tests need to be completed, and automated equipment is required for testing. At the same time, it is necessary to consider The stability of the production line process. The current designs are all independent designs, and the design has not yet reached a better state. Contents of the invention [0003] Embodiments of the present invention provide a main board test circuit and related products, which can realize the combined design of the test circuit to achieve better state advantages. [0004] In the first aspect, an embodiment of the present invention provides a motherboard test circuit, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F11/22
Inventor 李路路
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD