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Inspection method, method of manufacturing semiconductor package

A detection method, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of difficult manipulation and testing of semiconductor chips, difficulty in adjusting the number of semiconductor chip bumps, etc.

Active Publication Date: 2018-01-12
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it may be difficult to adjust the number of bumps of the semiconductor chip
In addition, due to the reduction in size of semiconductor chips, handling and testing of semiconductor chips can be difficult

Method used

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  • Inspection method, method of manufacturing semiconductor package
  • Inspection method, method of manufacturing semiconductor package
  • Inspection method, method of manufacturing semiconductor package

Examples

Experimental program
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Embodiment Construction

[0027] Hereinafter, some example embodiments of the inventive concepts will be described in detail with reference to the accompanying drawings.

[0028] figure 1 is a schematic diagram illustrating a detection system according to some embodiments of the inventive concept, figure 2 is showing figure 1 Perspective view of part of the image measuring device.

[0029] refer to figure 1 and figure 2 , the inspection system 1000 may include: a platform 400 on which the substrate 100 is loaded; an image measuring device 200 for measuring an image of a pattern formed on the substrate 100; and a computer 300 for storing and processing the images obtained from the image measuring device 200 image data. The vision measuring device 200 may be a device for non-destructive testing.

[0030] The image measuring device 200 may include: a first light source 210 and a second light source 220 for irradiating light onto the top surface of the substrate 100; a reflective part 230 for contr...

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PUM

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Abstract

An inspection method includes generating first layout data including information on a shape of a first pattern group, generating second layout data including information on a shape of a second patterngroup, obtaining a target image including images of the first and second pattern groups, and detecting a defect pattern from the target image by comparing the first and second layout data with the target image. The first pattern group, the second pattern group, and the defect pattern are provided at different heights from each other, from a top surface of a substrate.

Description

technical field [0001] Example embodiments of the inventive concept relate to an inspection method, an inspection system, and / or a method of manufacturing a fan-out package using the same. Background technique [0002] Since the semiconductor chip has been highly integrated, the size of the semiconductor chip can be reduced. However, the distance between bumps on a semiconductor chip may be set by an international standard of an international standard association such as the Joint Electron Device Engineering Council (JEDEC). Therefore, it may be difficult to adjust the number of bumps of the semiconductor chip. Furthermore, due to the reduction in size of semiconductor chips, handling and testing of semiconductor chips can be difficult. In addition, boards on which semiconductor chips are mounted vary based on the size of the semiconductor chips. To address these, fan-out type packaging has been developed. [0003] The fan-out type packaging process may include packaging...

Claims

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Application Information

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IPC IPC(8): H01L21/66H01L21/50
CPCG06T7/001H01L22/12H01L22/30H01L24/19H01L2224/18G06T2207/30148H01L2924/1815H01L2224/96H01L2224/04105H01L2224/12105H01L2924/0001H01L22/24H01L23/528H01L23/5386H01L27/0207H01L24/03H01L2224/02379G06T7/0008
Inventor 孙荣薰梁裕信
Owner SAMSUNG ELECTRONICS CO LTD