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A dry nozzle for wet etching, wet etching equipment

A wet etching and drying technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as the influence of wafer yield, failure to meet the drying process requirements, and difficulty in accurately controlling the gas temperature, so as to improve the quality of wafers. The effect of yield

Active Publication Date: 2020-02-07
YANGTZE MEMORY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

During the drying process, the gas is controlled at a certain temperature, delivered to the drying nozzle, and then sprayed onto the surface of the wafer. During the transmission process, the temperature of the gas will decrease, and it is usually lower than the preset temperature when it reaches the nozzle. , making it difficult to precisely control the gas temperature, and unable to meet the requirements of the drying process, resulting in the impact of wafer yield

Method used

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  • A dry nozzle for wet etching, wet etching equipment
  • A dry nozzle for wet etching, wet etching equipment
  • A dry nozzle for wet etching, wet etching equipment

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Embodiment Construction

[0026] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0027] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0028] As described in the background art, in wet etching, after chemical reaction and cleaning, a drying process is required. In the drying process, the wafer is dried by blowing gas at a certain temperature to the wafer. At present, the gas controlled to a certain temperature is delivered to the drying nozzle...

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Abstract

The invention provides a drying nozzle for wet etching. A heating device is arranged in a dry gas transmission nozzle, an actual temperature of gas in a gas guide tube is detected through a temperature detection device, heating control is performed according to the actual temperature and a target temperature through a temperature control unit, and accordingly the temperature of dry gas jetted to wafers can be accurately controlled. By the drying nozzle, accurate control of the gas temperature is realized, the drying process requirement is met, and wafer yield is increased.

Description

technical field [0001] The invention relates to the field of semiconductor etching equipment, in particular to a dry nozzle for wet etching and wet etching equipment. Background technique [0002] Etching is a very important process in the field of semiconductor manufacturing. Wet etching uses an etching solution to chemically react with the material to be etched to remove the part that needs to be etched, thereby forming a specific pattern on the material to be etched . [0003] In wet etching, it usually includes three steps of chemical reaction, cleaning and drying. During the drying process, a certain temperature gas is sprayed to the wafer through the drying nozzle to realize the drying of the wafer. The gas is usually N 2 (nitrogen) or IPA (isopropanol) to remove moisture from the wafer surface. During the drying process, the gas is controlled at a certain temperature, delivered to the drying nozzle, and then sprayed onto the surface of the wafer. During the transmis...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
Inventor 吴良辉蒋阳波张静平李君顾立勋
Owner YANGTZE MEMORY TECH CO LTD