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Camera module and encapsulation method thereof

A technology of camera module and packaging method, which is applied in the direction of image communication, TV, color TV parts, etc., can solve the problems of inapplicable electronic equipment miniaturization and large installation area, and achieve low cost, reduce installation area, and form The effect of simple process

Active Publication Date: 2018-01-12
TRULY OPTO ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the packaged and protected camera module requires a relatively large installation area, which is not suitable for the miniaturization of electronic equipment.

Method used

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  • Camera module and encapsulation method thereof
  • Camera module and encapsulation method thereof
  • Camera module and encapsulation method thereof

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Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0042] In the existing camera module, the photosensitive chip bound on the circuit board needs to be accommodated through the ceramic base, and the ceramic base is used as a bearing structure, and an optical component is arranged on it. However, the ceramic base needs to occupy a larger area, resulting in a larger mounting area of ​​the circuit board.

[0043] In order to solve the above problems, in the embodiment of the present invention, the photosensitive ...

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Abstract

The invention discloses a camera module and an encapsulation method thereof. According to the technical scheme, when a plastic encapsulation layer is formed, a photosensitive region of a photosensitive chip is protected by virtue of a high-temperature-resistant film, so that the situation that the photosensitive region is stained by a plastic encapsulation material is avoided; the photosensitive chip is sealed and protected by virtue of the plastic encapsulation layer, the plastic encapsulation layer serves as a bearing structure of an optical module, the material forming the plastic encapsulation layer has relatively strong hardiness after being cured and can be used for mounting the optical module, and an additional component does not need to be used for mounting the optical module, so that the area of a plane at which the camera module is located is reduced, and the required mounting area of the camera module is further reduced; and the plastic encapsulation layer has a sealing-protecting effect and is simple in formation process and low in cost.

Description

technical field [0001] The present invention relates to the technical field of camera modules, and more specifically, to a camera module and a packaging method thereof. Background technique [0002] With the continuous development of science and technology, more and more electronic devices with image acquisition functions are widely used in people's daily life and work, which brings great convenience to people's daily life and work, and has become the Indispensable and important tool. [0003] An important part of an electronic device to realize the image acquisition function is a camera module, and the camera module mainly includes a photosensitive chip, a filter, and a lens. In order to facilitate the installation and use of the camera module, avoid contamination and ensure the performance of the camera, it is necessary to package and protect the components in the camera module. [0004] In the prior art, the packaged and protected camera module requires a relatively lar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
Inventor 蔡定云杨永超
Owner TRULY OPTO ELECTRONICS
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