5results about How to "Simple forming process" patented technology

The utility model discloses a flexible optical fiber cable, which comprises a strip-shaped flexible shaft core and at least one wire rod, a wire rod positioning part is arranged outside the shaft core, at least one spiral groove is formed in the wire rod positioning part, and the wire rod is arranged in the spiral groove to form a spiral shape; the wire includes an optical fiber. According to the utility model, the wire rod at least comprising the optical fiber is accommodated in the spiral groove, the optical fiber can be protected by using the spiral groove, and the optical fiber is prevented from being abrupt outside the flexible wire body, so that the lateral pressure resistance and the axial friction resistance of the optical fiber are greatly improved, and the optical fiber is not easy to break in the use process.

The semiconductor structure provided by the present disclosure comprises: a substrate; a stack structure on the substrate, the stack structure comprising a plurality of first semiconductor layers arranged in a direction perpendicular to a top surface of the substrate, each of the first semiconductor layers comprising a plurality of channel regions arranged in a first direction and first and second doped regions distributed on opposite sides of each of the channel regions in a second direction; the first and second directions are both parallel to the top surface of the substrate, and the first direction intersects the second direction; and a word line structure comprising a plurality of word lines extending in the first direction, edges of the word lines being flush with edges of the channel regions in the second direction. The horizontal word line structure formed by the present disclosure can be applied to semiconductor structures with continuously shrinking dimensions, can improve the performance of the semiconductor structure, and can simplify the manufacturing process.

The invention belongs to the technical field of material forming, and discloses a reinforced thin-wall carbon fiber shell hot-press forming method which comprises the following steps: laying carbon fiber prepreg in a mold from inside to outside, firstly laying ribs, and then laying skin to form a prepreg blank; continuously and sequentially laying a carbon fiber pad with demolding cloth, a silicon rubber pad, an isolating membrane, a breathable felt and a vacuum bag membrane on the surface of the mold, integrally sealing by using a sealing rubber strip, vacuumizing and compacting, and curing in an autoclave; and after curing is finished, cooling, opening the tank, taking out, demolding after cooling to room temperature, and removing the mold and auxiliary materials to obtain the reinforced thin-wall carbon fiber shell. According to the invention, the silicon rubber pad is added on the carbon fiber pad, so that the carbon fiber participating in hot pressing is thickened, and the external soft silicon rubber pad is used as the substrate, so that the pressure transmission of the reinforced structure to the non-reinforced side surface is fundamentally counteracted, and the convex mark defect is thoroughly eliminated. The method is suitable for manufacturing the reinforced thin-wall carbon fiber shell in the aerospace industry.

The embodiment of the invention provides a semiconductor structure, a manufacturing method thereof and electronic equipment, which are used for solving the technical problem of how to simplify a forming process of a bit line structure. The manufacturing method comprises the steps that a substrate is provided, the substrate comprises a plurality of semiconductor patterns arranged in the first direction, each semiconductor pattern comprises a first part extending in the second direction and a plurality of second parts arranged at intervals in the second direction and connected with the first part, and a groove is formed between every two adjacent first parts; forming a doped dielectric layer covering the groove and the first part; executing a first annealing process on the substrate on which the doped dielectric layer is formed, so that doped ions in the doped dielectric layer are diffused into the first part and the second part to respectively form a doped first part and a doped second part; removing the doped dielectric layer to expose the doped first part; based on the doped first portion, a bit line structure is formed, the bit line structure connecting the doped second portion. Therefore, the forming process of the bit line structure is simplified.

The invention discloses an electric drive product packaging structure and a forming method thereof. The electric drive product packaging structure comprises a base island and a plurality of discrete pins located around the base island. The power chip is mounted on the base island, and the power chip is electrically connected with the pin; the plurality of discrete first vertical bonding wires are positioned on the power chip and are electrically connected with the power chip; the plurality of discrete second vertical bonding wires are positioned on the corresponding pins and are electrically connected with the corresponding pins; the first plastic packaging layer wraps the power chip, the first vertical bonding wire and the second vertical bonding wire, and the top ends of the first vertical bonding wire and the second vertical bonding wire are exposed out of the first plastic packaging layer; the control chip is mounted on the first plastic package layer and is electrically connected with the corresponding first vertical bonding wire and the second vertical bonding wire, and the sensor chip is mounted on the first plastic package layer right above the power chip and is electrically connected with the corresponding second vertical bonding wire. The size of a packaging structure of an electric drive product is reduced, and the integration level is improved.