Circuit substrate and its formation method and semiconductor encapsulation
A circuit substrate and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as difficult formation of multi-layer circuit lines
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[0076] A circuit substrate, a method of manufacturing the circuit substrate, and a semiconductor package with circuit lines according to specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0077] figure 1 A plan view of a circuit substrate according to a specific embodiment of the present invention is shown. figure 2 Yes figure 1 Partial enlarged view of part 'A' of . image 3 for along figure 1 The cross-sectional view of the I-I' line.
[0078] refer to figure 1 , the circuit substrate 100 includes a substrate main body 10 and circuit lines 20 .
[0079] The substrate main body 10 may be in the shape of a plate, or may be a printed circuit board. Alternatively, the substrate body 10 may have a different shape, and may be an insulating plate or a semiconductor chip.
[0080] The first terminal 15 and the second terminal 18 may be disposed on the upper surface of the substrate body 10 , the firs...
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