Temperature-controllable cooking device and temperature control method
A cooking device and temperature value technology, applied in the field of kitchen utensils, can solve problems such as coking, food nutrition loss, and inconvenient use
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Embodiment 1
[0094] Such as figure 1 , figure 2 As shown, the present invention relates to a temperature-controllable cooking device, which includes a housing 3, an electromagnetic generating device 5 provided in the housing 3, a panel located above the electromagnetic generating device 5, and a control electrically connected to the electromagnetic generating device 5. The unit 4 and the electric heating device 2 connected to the control unit are provided with a pot 6 above the panel 1, and at least a part of the panel 1 is a temperature control layer 11 capable of inducing electromagnetic signals generated by the electromagnetic generating device 5. The electromagnetic generating device 5 is mainly composed of an electromagnetic coil, a signal generating unit, and a signal receiving unit, and the electromagnetic coil is electrically connected to the signal generating unit and the signal receiving unit, respectively. The electromagnetic generating device is used to generate an electromagnet...
Embodiment 2
[0124] This embodiment is improved on the basis of embodiment 1, such as image 3 As shown, a pot 6 is provided on the panel of this embodiment, and the pot 6 includes a pot body and a pot bottom. In this embodiment, the setting position of the temperature control layer 11 is changed, and the temperature control layer 11 is set on the pot of the pot 6. Bottom or pot body, rather than set in panel 1. The bottom of the pot 6 can be made of a layer of metal, or can be made of multiple layers of metal composite, for example, can be composited with aluminum layers, steel layers, etc., and the temperature control layer can be set on the pot. The upper surface of the bottom of 6 can also be arranged on the lower surface, and it can also be arranged between the upper and lower surfaces of the bottom of the pot 6. For pots capable of three-dimensional heating, the temperature control layer 11 can also be arranged on the pot body of the pot.
[0125] The rest of the structure of this embo...
Embodiment 3
[0127] In this embodiment, the temperature control layer is improved on the basis of embodiment 1. The temperature control layer 11 is provided with at least one through hole, and usually several through holes are evenly arranged. The total area of the through holes accounts for the control layer. The percentage of the total area of the temperature layer is 5%-50%. This arrangement can not only save the production cost of the temperature control layer 11, but also can satisfy the effect of the temperature control layer to the greatest extent.
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