CPU component product suite packaging box and packaging method

A set packaging and packaging technology, which is applied in the field of CPU components productized packaging, can solve the problems of material cost, control problems, increase the sense of volume of the packaging, and will not arrive at the same time, so as to facilitate procurement and warehouse management, meet the Ease of use and operability, the effect of reducing the variety of materials

Pending Publication Date: 2018-01-19
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As one of the three major parts of the server, the CPU, the commonly used component product packaging method is to use one package for a single CPU. Since the CPU itself is small in size, the package should be appropriately enlarged to increase the volume of the package and avoid Lost, omitted, and more packaging materials are a waste in terms of cost
In addition, the CPU radiator is an indispensable part of the CPU work, and the two are in a one-to-one combination and matching relationship. In most server expansion situations, the user must purchase the CPU part and the radiator part at the same time; when cooling When the device is also packaged separately, in the logistics and transportation link, the two kinds of component packages that need to be used together are very easy to be separated and lost, or the matching relationship is mistaken, and they may not arrive at the same time, resulting in a delay in timeliness
Moreover, the specifications of the radiators are also varied, and each radiator is individually designed and packaged, which not only increases the design cost, but also causes difficulties in material cost and control

Method used

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  • CPU component product suite packaging box and packaging method
  • CPU component product suite packaging box and packaging method
  • CPU component product suite packaging box and packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A CPU component product package packaging box, including a cuboid outer box, including a liner 1 and a liner 2 arranged up and down in the box, and a liner 1 and a liner 2 above the liner 1 and liner 2 from bottom to top Liner three 3, liner four 4 arranged in sequence, liner one 1, liner two 2, liner three 3, liner four 4 are rectangular parallelepiped structures with equal perimeters and arranged up and down closely with the inner wall of the outer box fit;

[0038] Wherein, the upper surface of the liner-1 is provided with a rectangular radiator groove-12, and the two opposite side walls before and after the radiator groove-12 are provided with a gap-13 that runs through the upper and lower sides of the liner-1, and the radiator groove-1 The bottom of 12 is provided with a bottom stop 14 fixed on the liner 1, and the bottom of liner 1 is provided with a bottom notch 15, and the bottom notch 15 runs through the front and rear side walls of liner 1 and runs through the...

Embodiment 2

[0048] A package packaging method for the productization of CPU components. The first liner 1 is placed at the bottom of the outer box, the second liner 2 is placed above the first liner 1, the first gap 13 and the second gap 11 are superimposed, and the 2U-sized The radiator is placed in the radiator slot composed of radiator slot 2 10 and radiator slot 1 12. According to different radiators, crisp plates of different specifications are equipped (crisp plates are used at the bottom of the radiator to protect the bottom of the thermal grease. The size of the original protective device) is selected to install the movable block; the notch 15 at the bottom of the gasket 1 corresponds to the position of the heat-conducting silicone grease;

[0049] Place liner 3 3 on top of liner 2 2, place the CPU in CPU slot 7, and finally fasten liner 4 4 on top of liner 3 3 to completely wrap the CPU in it, with buffer protection on each side .

[0050] Liner 3 3 is below the CPU and placed o...

Embodiment 3

[0059] A package packaging method for the productization of CPU components, in which liner 2 is placed at the bottom of the outer box, liner 1 is placed above liner 2, and a 1U radiator is placed in radiator slot 12 According to the size of the different specifications of the crisp plate (the crisp plate is the original protective device used to protect the bottom thermal grease at the bottom of the radiator) to choose and install the movable block; liner 1 1 bottom notch 15 corresponds to thermal grease Location;

[0060] Place liner 3 3 on top of liner 2 2, place the CPU in CPU slot 7, and finally fasten liner 4 4 on top of liner 3 3 to completely wrap the CPU in it, with buffer protection on each side .

[0061] Liner 3 3 is below the CPU and placed on the top of the heat sink; the heat sink is a metal part with high hardness, so the bottom of liner 3 3 is slotted at a height of 5mm corresponding to the position of the CPU, so that the middle of liner 3 is suspended above ...

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Abstract

The invention discloses a CPU component product suite packaging box and a packaging method. A single and a single radiator are packaged into one packing box to form a component product suite. Terminalmarketing and customer service maintaining are facilitated. The CPU component product suite packaging box can meet the requirements for combination packaging of the CPU and the radiator, the number of packaged parts is reduced, and the cost of packaging materials is lowered. Through combination changes of a buffering cushion structure in a package, the universality of the package on various specifications of radiators is achieved.

Description

technical field [0001] The invention relates to the field of packaging of CPU components, in particular to a packaging box and a packaging method for the productization of CPU components. Background technique [0002] With the rapid development of the Internet, the promotion and popularization of cloud computing and big data, the use of server products is becoming more and more extensive, and the requirements for server performance are also getting higher and higher. In the face of a large number of new demands for performance improvement, the demand for server reconfiguration and upgrade by adding server components is also increasing day by day; at the same time, the maintenance and replacement of server components is also to ensure stable server performance, thereby promoting the stability of the foreground application environment important condition. Therefore, the demand for a large number of components has led to a surge in the demand for productization of components. ...

Claims

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Application Information

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IPC IPC(8): B65D5/50B65D77/26B65D85/62
CPCY02W30/80
Inventor 曲玮丽
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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