A method and system for solving internal tin connection of 0402 type rcl parts

Abstract

The invention discloses a method and a system for solving the problem of continuous tin electro-deposit inside 0402-type RCL parts. The method includes the following steps: creating a detection module, and detecting the spacing between the two PADs of a current PCB through the detection module; creating a comparison module, and comparing the spacing data of the two PADs detected with the spacing data of two PADs which are proved through simulation to have the problem of continuous tin electro-deposit; and when the spacing between the two PADs detected is smaller than or equal to the spacing between the two PADs which will have the problem of continuous tin electro-deposit, confirming the positions of two electrodes of a part frame, cutting off the inner sides corresponding to the two PADsaccording to the positions of the two electrodes of the part frame to make the distance between the PADs of the PCB reach a spacing without continuous tin electro-deposit. The method and the system are applicable to the production of PCBAs of all electronic products, and can reduce the maintenance cost, board scrap cost, manpower cost and the like brought about by continuous tin electro-deposit. Alot of cost resources are saved, and the output of qualified products is increased. Therefore, the production efficiency is increased, and greater economic benefit is brought to companies.

Description

technical field [0001] The invention relates to the technical field of computer board manufacturing, in particular to a method and system for solving the problem of internal tin connection of 0402 type RCL parts. Background technique [0002] At present, in the field of all PCBA boards such as servers, 0402 (inch) (hereinafter collectively referred to as 0402) type RCL parts can be seen everywhere and are widely used. However, as the size of the parts gradually decreases, the corresponding defects will increase. The basic defects include deviation, tombstone, side standing and other defects. It is difficult to detect the poor tin connection with the naked eye, especially the internal tin connection, which can only be checked by some perspective inspection machines (such as X-RAY inspection machine), or by some functional testing methods. After analysis, it is confirmed that the reason for this kind of internal tin connection is that the PCB PAD design is unreasonable, and t...

AI Technical Summary

Problems solved by technology

After analysis, it is confirmed that the reason for this kind of internal tin connection is that the PCB PAD design is unreasonable, and the distance between the pads is relatively close. When the solder paste is printed and the parts are attached, the solder paste will definitely be squeezed by the parts. , and the extruded solder paste will be easily connected together, so it is easy to have the problem of internal solder connection, resulting in poor solder connection

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