Three-dimensional high-density fan-out packaging structure and manufacturing method thereof

A packaging structure and fan-out technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as high manufacturing cost, high packaging thickness, and complicated process

Active Publication Date: 2020-10-02
NAT CENT FOR ADVANCED PACKAGING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Most of these three-dimensional integrated circuit packaging structures and methods based on the prior art need to use PCB circuit boards, adapter boards and TSV through holes, which have high manufacturing costs, complicated processes, and high packaging thickness.

Method used

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  • Three-dimensional high-density fan-out packaging structure and manufacturing method thereof
  • Three-dimensional high-density fan-out packaging structure and manufacturing method thereof
  • Three-dimensional high-density fan-out packaging structure and manufacturing method thereof

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Embodiment Construction

[0040] In the following description, the present invention is described with reference to various examples. One skilled in the art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of embodiments of the invention. However, the invention may be practiced without these specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0041] In this specification, reference to "one embodiment" or "the...

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Abstract

The embodiment of the present invention discloses a three-dimensional fan-out packaging structure, comprising: a first chip; one or more second metal pillars, and the one or more second metal pillars are arranged on the periphery of the first chip A second chip composed of one or more chips, the second chip is stacked on the back of the first chip, and its surface pad is electrically connected to the second metal post through a metal wire; the second insulating resin, the first chip Two insulating resins encapsulate the first chip, the second chip and the second metal post, and the surface of the first metal post, the surface of the first insulating resin, the bottom surface of the second metal post, and the bottom surface of the second insulating resin flush; and rewiring structures. The packaging structure disclosed by the invention has the advantages of small size and low cost.

Description

technical field [0001] The invention relates to the packaging field, in particular to an ultra-thin three-dimensional high-density fan-out packaging structure and a manufacturing method thereof. Background technique [0002] Three-dimensional integrated circuit packaging has many advantages, such as high packaging density and small footprint. There are various three-dimensional integrated circuit packaging structures and three-dimensional integrated circuit packaging methods in the prior art. [0003] Figure 6 A schematic cross-sectional view of a prior art PoP (package on package) package structure is shown. The PoP package is fabricated by stacking two packages, including a top package 101 and a bottom package 102 , with a total thickness of approximately 1.4mm. Top package 101 contains stacked die 103 . The top package 101 and the bottom package 102 each contain a circuit board (circuit board thickness 0.3 mm) and a set of solder balls 104 (solder ball height 0.25 mm)...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/065H01L25/18H01L23/488H01L21/98
CPCH01L2924/181H01L2224/16225H01L2224/32145H01L2224/48091H01L2224/73253H01L2224/73265H01L2924/00012H01L2924/00014
Inventor 陈峰张文奇
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD
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