Metal packaging and nickel/gold electroplating process for packaging sidewall of circuit board by metal
A technology for electroplating nickel-gold and circuit boards, which can be used in secondary processing of printed circuits, reinforcement of conductive patterns, etc.
Inactive Publication Date: 2018-01-26
SHENZHEN XUNJIEXING TECH CORP LTD
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Problems solved by technology
[0003] In the mainstream manufacturing process, the gold-plated finger process can realize the side wall of the solder joint with gold, but it needs to separately make the lead wire to connect the solder joint and the board edge, and remove it after gold plating. It is only suitable for the side wall of the solder joint to be covered with gold. ;The production process of the nickel-gold electroplating process is simple, and there is no need to make separate leads, but it can only be plated with gold on the top layer of the solder joints, and cannot be made of gold-clad side walls
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[0013] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
[0014] One aspect of the present invention provides a gold-coated nickel-gold process on the side wall of a circuit board, including: forming an etching groove 1 on the copper surface of the circuit board by etching, and the etching groove 1 is coated with gold along the side wall. so that the sidewall 3 of the copper layer 2 that needs to be covered with gold is exposed; a dry film 4 is pasted on the copper layer 2, and a window 6 is formed on the dry film 4, and the window corresponds to The etching groove 1 and the copper plate area 5 that needs to be covered with gold surrounded by the etching groove 1 are set and expose the side wall; the circuit board is electroplated with nickel and gold, so that the copper plate area 5 and the side wall 3 Ni...
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The invention provides a metal packaging and nickel / gold electroplating process for packaging sidewall of a circuit board by metal. The method comprises the steps of forming etching troughs on the copper surface of the circuit board in an etching manner, wherein the etching troughs extend along to-be-packaged patterns of the sidewall, thereby exposing the to-be-packaged sidewall of a copper layer;applying a dry film on the copper layer, and forming open windows on the dry film, wherein the open windows are arranged in a manner of corresponding with the etching troughs and copper board areas to be packaged and are exposed from the sidewall; and performing metal electroplating on the circuit board, thereby electroplating one layer of nickel / gold on the copper board area and the sidewall. According to the method of the invention, the nickel / gold can be formed on the upper surface of the copper board area and the sidewall simultaneously in electroplating, thereby simultaneously realizingtop-layer metal electroplating and sidewall metal packaging.
Description
technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a gold-coated nickel-gold plating process on the side wall of a circuit board. Background technique [0002] With the development of the industry, more and more electronic products begin to use the bonding process to minimize the size of the product, so more and more PCBs use the electroplating nickel-gold surface process. [0003] In the mainstream manufacturing process, the gold-plated finger process can realize the side wall of the solder joint with gold, but it needs to separately make the lead wire to connect the solder joint and the board edge, and remove it after gold plating. It is only suitable for the side wall of the solder joint to be covered with gold. ; The production process of the nickel-gold electroplating process is simple, and there is no need to make leads separately, but it can only be plated with gold on the top layer of the solder joints, and cann...
Claims
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Inventor 马卓王铭钏
Owner SHENZHEN XUNJIEXING TECH CORP LTD