Lead-free paste used for novel solar battery electrode assembly

A technology for solar cells and electrode components, applied in the direction of conductive materials, conductive materials, electrical components, etc., can solve the problems of affecting the service life of solar cell modules, large differences in linear expansion coefficients, cracking and damage of silicon plates, etc., to avoid silicon wafers Cracking phenomenon, improved electrical and thermal conductivity, and improved service life

Active Publication Date: 2018-02-02
BEIJING COMPO ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, traditional silver paste and welding materials are used to connect the substrate and electrodes. Due to the large difference in linear expansion coefficient among the substrate silicon mat

Method used

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  • Lead-free paste used for novel solar battery electrode assembly
  • Lead-free paste used for novel solar battery electrode assembly
  • Lead-free paste used for novel solar battery electrode assembly

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0026] Example 1

[0027] A new type of lead-free paste for solar cell electrode components. The prepared Sn-Bi-Sb-Ni alloy powder is added with flux and stirred into a lead-free solder paste. T3 (25-45μm) type powder is selected, and the flux ratio is 11.5%. The prepared solder paste is screen-printed to the through-hole electrode lattice, heated and cured at a curing temperature of 170°C, and the curing time is 4 minutes to form a through-hole electrode, which forms an ohmic connection with the battery silicon plate, and is used to derive the nearby light output Current. The lead-free solder paste alloy powder contains: Bi 45%, Sb 2.5%, Ni 0.005%, and the rest is Sn.

Example Embodiment

[0028] Example 2

[0029] A new type of lead-free paste for solar cell electrode components. The prepared Sn-Bi-Sb-Ni-Ag-Cr alloy powder is stirred into a lead-free solder paste with flux, and T5 (15-25μm) type powder is selected. The flux ratio is 15%. Apply the prepared solder paste to the through-hole electrode dot matrix through a syringe, heat and cure at a curing temperature of 168°C, and a curing time of 4.5min to form a through-hole electrode, which forms an ohmic connection with the battery silicon plate for exporting nearby Light out current. The lead-free solder paste alloy powder contains: Bi 60%, Sb 7.0%, Ni 0.1%, Ag 2.1%, and the rest is Sn.

Example Embodiment

[0030] Example 3

[0031] A new type of lead-free paste for solar cell electrode components. The prepared Sn-Bi-Al-Ag-Cu alloy powder is added with flux and stirred into a lead-free solder paste. T3 (25-45μm) type powder and flux are selected The ratio is 8%. The prepared solder paste is screen-printed to the through-hole electrode lattice, heated and cured at a curing temperature of 175°C, and the curing time is 3.8 minutes to form a through-hole electrode, which forms an ohmic connection with the silicon plate of the battery, and is used to extract the light nearby. Out of current. The lead-free solder paste alloy powder contains: Bi50%, Al 1.8%, Cu 0.5%, Ag 1.5%, and the rest is Sn.

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Abstract

The invention discloses lead-free paste used for a novel solar battery electrode assembly. The lead-free paste is prepared from the following components based on weight percentages: 8-15% of solderingflux and the balance of Sn-based alloy powder; the Sn-based alloy is selected from Sn-Bi series lead-free alloy or Sn-In series lead-free alloy; the Sn-based alloy powder has the granularity of (25-45[mu]m), T4(20-38[mu]m) or T5(15-25[mu]m); the curing temperature of the Sn-based alloy is less than 200 DEG C, and the melting point is less than 170 DEG C; and the lead-free paste is formed by adding the soldering flux into the Sn-based alloy powder through stirring. The paste is added to a through hole electrode in a dispensing or silk-screen printing manner to be heated, fused and cured to form a through hole filling hole electrode dot matrix in order to form ohmic connection with a battery silicon plate so as to conduct nearby light-generated current; the through hole formed through curing is wholly connected by metal, so that the conversion efficiency of the battery can be further improved based on high electrical conductivity and high thermal conductivity of metal; and the coefficient of linear expansion of the paste is closer to that of the Si material of a battery substrate, so that a phenomenon of silicon wafer cracking can be avoided, and the service life of the solar battery can be prolonged.

Description

Technical field [0001] The invention belongs to the technical field of photovoltaic industrial component materials; in particular, it relates to a novel lead-free paste for solar cell electrode components. Background technique [0002] In the traditional solar cell manufacturing process, the electrodes are mainly prepared by sintering the positive silver paste and the back aluminum paste, and the prepared single-group cells are connected through tinned copper tape grid components to form a modular solar cell group. Among them, the main material of the electrode paste is the noble metal Ag, and its cost is about 40% of the cost of the entire solar cell. In recent years, how to reduce the use of silver paste without affecting the conversion efficiency of solar cells, domestic Foreign research institutions and companies have done a lot of research, but the results are not satisfactory. The tin-plated copper strip tin-plated material used for grid connection is mostly Sn-Pb40 alloy....

Claims

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Application Information

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IPC IPC(8): H01B1/02H01L31/0224
CPCH01B1/02H01B1/023H01L31/022425
Inventor 贺会军刘希学王志刚安宁朱捷温余苗张富文张江松赵朝辉林刚祝志华刘英杰刘建王丽荣徐蕾
Owner BEIJING COMPO ADVANCED TECH
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