45results about How to "Reduce Reliability Risk" patented technology

The invention discloses a cover plate, a forming method thereof, a cover plate mother board and electronic equipment. The forming method of the cover plate comprises the following steps: providing a mother board base, wherein the mother board base comprises a base layer and a sacrificial layer positioned on the base layer; carrying out schematization on the sacrificial layer to form a graphic sacrificial layer; and by using the graphic sacrificial layer as a mask, etching the base layer to form a substrate and a texture bulging the substrate. The substrate and the texture are formed by etchingthe base layer, compared with a glass cover plate comprising a UV glue material graphic layer, the application of the UV glue material graphic layer is omitted, the problems caused by the UV glue material graphic layer and a forming technology thereof can be avoided effectively, the performance, reliability and manufacturing yield of the formed cover plate are improved, the structure of the coverplate is simplified, the light transmittance of the cover plate is improved, and the performance and aesthetic degree of the formed electronic equipment are improved.

The invention discloses an optical module. The optical module comprises an upper shell, a lower shell, a circuit board, a lens assembly and a clamping jaw assembly, and the lens assembly is arranged at the end, close to an optical port of the optical module, of the circuit board; the clamping jaw assembly is arranged at the optical port of the optical module, one end of the clamping jaw assembly is directly connected with the lens assembly, and the other end of the clamping jaw assembly is connected with an external optical fiber; the clamping jaw assembly comprises a clamping jaw and a shielding plate connected with the clamping jaw, a first limiting piece is arranged on the lower shell, a second limiting piece is arranged on the clamping jaw, and the first limiting piece is embedded in the second limiting piece; and a first positioning piece is arranged in the first limiting piece, a second positioning piece is arranged on the side face, provided with the second limiting piece, of the clamping jaw, and the second positioning piece is inserted into the first positioning piece. According to the optical module, the lens assembly is arranged at the end, close to the optical port of the optical module, of the circuit board, direct connection between the external optical fiber and the lens assembly is achieved through the clamping jaw assembly fixed to the shells, an optical fiberribbon is not needed, space is saved to a certain degree, and further development of the optical module is facilitated.

The invention provides a pump body assembly, a rotary compressor and an air conditioner. The pump body assembly comprises an air exhaust chamber; the air exhaust chamber is provided with a first air exhaust port; a silencer is arranged at the downstream of the first air exhaust port; the silencer is used for buffering and reducing noise of airflow exhausted by the first air exhaust port; a secondair exhaust port is formed in the silencer; the through-flow area of the first air exhaust port is S1; the through-flow area of the second exhaust port is S0; and S0 and S1 satisfy an relational expression that 0.314<S0 / S1<0.865. According to the pump body assembly, the rotary compressor and the air conditioner, the oil spitting rate of the compressor can be reduced, so that the reliability risk of the compressor caused by insufficient lubrication due to a too high oil spitting rate is reduced; and the refrigerating capacity of the compressor is improved, and high efficiency of the compressoris achieved.

The invention discloses an optical module. The optical module comprises a circuit board, a light emitting chip, a light receiving chip, a lens assembly and a clamping jaw assembly, the lens assembly is arranged at the end, close to an optical port of the optical module, of the circuit board and covers the light emitting chip and the light receiving chip, one end of the clamping jaw assembly is connected with the lens assembly, and the other end of the clamping jaw assembly is connected with an external optical fiber; the clamping jaw assembly comprises a clamping jaw and a shielding plate, a first positioning piece is arranged on the clamping jaw, a second positioning piece and a third positioning piece are correspondingly arranged on the shielding plate and the lens assembly respectively,and the first positioning piece penetrates through the second positioning piece and is inserted into the third positioning piece; and the lens assembly comprises a lens assembly body and a lens assembly connecting part which are connected with each other, a light through groove is formed in the lens assembly connecting part, a light through hole is formed in the shielding plate, and light path connection of the lens assembly and the clamping jaw assembly is achieved through the light through hole and the light through groove. According to the optical module provided by the invention, transmission of internal optical signals does not need an optical fiber ribbon, so that space is saved to a certain extent, and further development of the optical module is facilitated.

The invention discloses a vibration sensor and electronic equipment, and the vibration sensor comprises a circuit board assembly, a housing, a vibration pickup assembly, a supporting shell and a chip assembly, and the housing covers one side of the circuit board assembly to form an installation space in a surrounding manner; the vibration pick-up assembly is arranged in the installation space and used for picking up external bone vibration to generate response vibration; the supporting shell is connected to the side, away from the circuit board assembly, of the vibration pickup assembly. The chip assembly is connected to the side, away from the circuit board assembly, of the supporting shell and electrically connected with the circuit board assembly. A conduction cavity is defined by the vibration pickup assembly, the supporting shell and the chip assembly, so that response vibration is transmitted to the chip assembly through the conduction cavity. According to the technical scheme, the structure of the vibration sensor is simplified, the machining difficulty and cost are reduced, and meanwhile the structural reliability of the vibration sensor is improved.

The invention discloses a temperature maintaining device for an integrated circuit chip. The temperature maintaining device comprises anon-chip heating resistor which is composed of metal circuits ofthe chip, an on-chip temperature detecting circuit used for detecting the inner temperature of the chip, and a heating control circuit controlling switching on and switching off of heating current ofthe on-chip heating resistor based on the temperature value detected by the on-chip temperature detecting circuit to achieve chip temperature control in an on-chip mode. The invention further discloses a temperature maintaining method of the integrated circuit chip. Temperature maintaining of the chip can be achieved, especially, the temperature of the chip can be maintained at the normal workingtemperature when the chip works in the low temperature environment, and therefore temporary failure or permanent failure of the integrated circuit of the chip can be prevented. The cost and power consumption can be reduced, device accuracy requirements can be greatly reduced, reliability risk can be lowered, a manufacturing process window can be improved, the service life of the chip can be prolonged, and the error rate can be reduced.

The invention discloses a production method of an LDMOS (Laterally Diffused Metal Oxide Semiconductor) with a selective shallow slot through hole. The production method of an LDMOS with a selective shallow slot through hole comprises forming a basic structure, forming bottom layer interlamination film; forming a blocking layer; etching the blocking layer which is arranged in an area of the shallow slot through hole; forming top layer interlamination film; performing multi-step high selective etching to form a normal through hole in an area of the blocking layer and the shallow slot through hole of a connector area in an area without the blocking layer; and injecting doping source which has the same type with the connector area at the bottom of the shallow slot through hole after a basic structure is formed. The invention also discloses an LDMOS structure which is produced through the production method. The production method of the LDMOS with the selective shallow slot through hole has the advantages of effectively reducing design size of a source end and an area of a chip and improving reliability of a component due to the fact that different types of doping areas which are vertically distributed in a specified area of the LDMOS are connected with each other with the help of a selective shallow slot through hole technology.

The invention discloses a process for reducing the soldering hole rate of a soldered printed board by adopting a polytetrafluoroethylene block. The process comprises the following steps of S1, manufacturing a soldering tin sheet corresponding to the printed board, placing the tin sheet in a shell firstly, then turning the printed board with a soldering flux coated to enable the front surface of the printed board to be upward, and feeding the printed board into the shell; S2, pressing the polytetrafluoroethylene block corresponding to the printed board on the printed board, covering the shell with a cover plate and fixing the cover plate with a screw; and S3, carrying out heating and welding treatment, wherein the polytetrafluoroethylene block is subjected to thermal expansion in the heating process to apply the pressing force to the printed board. The process has the beneficial effects that the pressing force is applied to the printed board by the polytetrafluoroethylene block which issubjected to thermal expansion in the heating process, and the heated and melted soldering tin is uniformly distributed under the action of the pressing force, so that the soldering hole rate of theprinted board is reduced, the performance and the reliability of the printed board are improved, the time for rework of product assembling is greatly saved, the soldering frequency is reduced, and theproduct reliability risk is reduced.

The invention discloses a loudspeaker unit and an electronic terminal. The loudspeaker unit comprises a shell assembly, a magnetic circuit system, a vibration system and a balance assembly, the balance assembly is arranged corresponding to a gap, the balance assembly comprises a centering support chip made of FPCB material, the centering support chip comprises an outer fixing part, an elastic support part and a bonding pad structure, and the outer fixing part is connected with the shell assembly; the elastic supporting part is connected with the outer fixing part, located in the gap and partially connected with a support, and the elastic supporting part elastically deforms along with vibration of the support. The bonding pad structure comprises a cantilever and a bonding pad which are arranged at an included angle, one end of the cantilever away from the bonding pad is connected with the elastic supporting part, the cantilever extends along the support, the bonding pad is fixedly connected with the diaphragm or the top wall of the support, and a lead of the voice coil is electrically connected with the bonding pad. According to the loudspeaker unit provided by the invention, the structure of a voice coil in the magnetic gap is arranged more freely, and the volume of a magnetic circuit system is effectively increased, so that the magnetic field intensity is higher, and the acoustic performance is better.

The application relates to the technical field of photovoltaics, and particularly relates to a photovoltaic junction box, a photovoltaic module and a photovoltaic junction box installation method. Thephotovoltaic junction box comprises a box body and a connection terminal arranged in the box body; a connection through hole for enabling the connection terminal to be exposed outside is formed at aposition on the box body, where the connection terminal is positioned, so that when the photovoltaic junction box is installed, the connection terminal is in contact with a bus bar of the photovoltaicmodule at a to-be-installed position. According to the photovoltaic junction box provided by the application, a case that the box body is completely hollowed out at the joint of the connection terminal and the bus bar to completely expose the connection terminal is avoided, so that leakproofness of the photovoltaic junction box is improved and filling of a potting adhesive is avoided, thereby avoiding reduction of module reliability and existence of safety risks, which are caused by non-solidification of the potting adhesive, simplifying the installation process and improving installation efficiency.

The invention relates to a high-reliability edge pulse generation circuit for an intelligent power module, which is based on a brand-new circuit design architecture and can be applied to high-side control signals with any pulse width, no matter whether the input signal is a normal pulse width, a narrow pulse, or even a super pulse width. The narrow pulse can ensure the normal output of the reset RESET pulse signal, which fundamentally solves the problem that the high-side output signal cannot be reset caused by the narrow pulse input signal, reduces the reliability risk of high-side and low-side MOSFET straight-through, and effectively guarantees all Apply the stability of the work of each module in the intelligent power module; not only that, the high-reliability edge pulse generation circuit designed by the present invention has a simple structure, which solves the limitation of the traditional edge pulse generation circuit on the input pulse width, thereby saving signal transmission. The multi-stage noise filter circuit in the path reduces the transmission delay of the signal and improves the working switching frequency.

The invention discloses a loudspeaker unit and an electronic terminal. The loudspeaker unit includes a shell assembly, a magnetic circuit system, a vibration system, and a balance assembly. The balance assembly includes a centering strut, and the centering strut includes: an outer A fixing part, an elastic supporting part and a connecting section, the outer fixing part is ring-shaped; the elastic supporting part is ring-shaped and is located inside the outer fixing part; the connecting section is located between the outer fixing part and the between the elastic support parts, and connect the external fixing part and the elastic support part; the external fixing part is connected with the housing assembly, and the elastic support part is located in the gap and partly connected with the bracket of the vibration system connected, the elastic support part elastically deforms with the vibration of the bracket. The purpose of the present invention is to provide a loudspeaker unit that can effectively prevent the bending part of the centering strut from being easily broken, so that the loudspeaker unit can effectively reduce the risk of product reliability.

The invention relates to the technical field of displays, in particular to a light guide plate compressing structure and a backlight module. The light guide plate compressing structure comprises a plastic frame, a rolling component and a compressing member, a protruding portion of the plastic frame is positioned between a display screen panel and a light guide plate, the lower portion of the protruding portion is provided with a deboss matched with the rolling component, the rolling component is positioned in the deboss and compressed by the compressing member arranged in the protruding portion, and the bottom of the rolling component is extended out of the protruding portion and contacts with the light guide plate to slightly press on the light guide plate. When the light guide plate expands in a high-temperature high-pressure experiment, the bottom of the rolling component and the light guide plate are in rolling friction, and the light guide plate moves and extends horizontally and does not deform due to expanding and being limited, so that reliability risk of the light guide plate is lowered.

The invention discloses a crystal oscillator frequency debugging system. The system includes: a test module which includes an adjustable capacitance module, an adjustable resistance module and an adjustable power supply; a connection clamping unit which has an input end and an output end, wherein the input end is in separate connection to the output ends of the adjustable capacitance module, the adjustable resistance module and the adjustable power supply, and the output end is intended for connecting a debugging bit of a to-be-debugged crystal oscillator; a frequency meter which is intended for connecting the to-be-debugged crystal oscillator and reading frequencies; a computing control module which is connected to a control end of the test module and the frequency meter and is intended for separately outputting capacitance control parameters, resistance control parameters and power control parameters to the adjustable capacitance module, the adjustable resistance module and the adjustable power supply so as to form required capacitance, resistance and power value which are to be loaded to the debugging bit of the to-be-debugged crystal oscillator, reading the frequency of the to-be-debugged crystal oscillator and adjusting the capacitance control parameters. According to the invention, the crystal oscillator frequency debugging system optimizes production procedures and increases production efficiency.

The invention provides an optical fingerprint identification module and a forming method thereof. The optical fingerprint identification module comprises an image sensor chip and a printed circuit board, the image sensor chip is located in the hollow area of the printed circuit board in a suspended mode and is electrically connected to the printed circuit board only through a metal wire. The overall thickness of the optical fingerprint recognition module is smaller than the thickness of an existing module, the optical fingerprint recognition module can be suitable for a portable electronic device, the height of the module is reduced while the imaging effect is guaranteed, and high integration and high density of electronic devices are achieved.