Temperature maintaining device and method for integrated circuit chip

An integrated circuit and holding device technology, which is applied in the direction of temperature control by electric means, can solve the problems of increasing cost and power consumption, and achieve the effect of reducing error rate, prolonging chip life and saving energy consumption.

Active Publication Date: 2019-01-11
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF15 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above methods will increase the cost and power consumption

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Temperature maintaining device and method for integrated circuit chip
  • Temperature maintaining device and method for integrated circuit chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] Such as figure 1 Shown is a schematic structural view of a temperature maintaining device for an integrated circuit chip according to an embodiment of the present invention; figure 2 is a schematic structural diagram of the on-chip heating resistor 2 of the embodiment of the present invention. The temperature maintaining device of the integrated circuit chip of the embodiment of the present invention comprises:

[0039] The on-chip heating resistor 2 is composed of the metal lines of the chip 1.

[0040] The on-chip temperature detection circuit 3 is used to detect the temperature inside the chip 1 .

[0041] The heating control circuit 4 controls the switching of the heating current of the on-chip heating resistor 2 according to the temperature value detected by the on-chip temperature detection circuit 3 , and realizes the temperature control of the chip 1 in an on-chip manner.

[0042] In the embodiment of the present invention, such as figure 2 As shown, the o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a temperature maintaining device for an integrated circuit chip. The temperature maintaining device comprises anon-chip heating resistor which is composed of metal circuits ofthe chip, an on-chip temperature detecting circuit used for detecting the inner temperature of the chip, and a heating control circuit controlling switching on and switching off of heating current ofthe on-chip heating resistor based on the temperature value detected by the on-chip temperature detecting circuit to achieve chip temperature control in an on-chip mode. The invention further discloses a temperature maintaining method of the integrated circuit chip. Temperature maintaining of the chip can be achieved, especially, the temperature of the chip can be maintained at the normal workingtemperature when the chip works in the low temperature environment, and therefore temporary failure or permanent failure of the integrated circuit of the chip can be prevented. The cost and power consumption can be reduced, device accuracy requirements can be greatly reduced, reliability risk can be lowered, a manufacturing process window can be improved, the service life of the chip can be prolonged, and the error rate can be reduced.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuits, in particular to a temperature maintaining device for integrated circuit chips. The invention also relates to a method for maintaining the temperature of the integrated circuit chip. Background technique [0002] Due to the changeable application environment of integrated circuit chips, when a low temperature environment occurs, the integrated circuit characteristics of the chip will shift. In extreme cases, there may even be a temporary failure or an irreversible operation triggered by an internal error, resulting in permanent failure, resulting in user losses. [0003] There are several known methods to maintain the temperature of the integrated circuit of the chip, such as the method of installing a heater outside the chip, the method of covering the entire circuit board with an insulating layer or the method of heating the liquid circulation system, etc., to help the chip mai...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/19
CPCG05D23/19
Inventor 张雨田
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap