Vibration sensor and electronic equipment

A vibration sensor and vibration cavity technology, applied in the field of sensors, can solve the problems of low performance reliability, low product yield, and lengthy manufacturing process, achieve compact internal structure, reduce processing difficulty and cost, and simplify the structure of the vibration sensor.

Pending Publication Date: 2021-09-28
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The microphone unit is usually surrounded by multiple circuit boards to form an internal space, and a chip module is arranged in the internal space, so that there are multiple bonding positions between multiple circuit boards, resulting in low reliability of product performance. Holes are opened on the circuit board to connect the chip module to the installation space of the vibration pickup unit. The structure is complex, the manufacturing process is lengthy, and the cost is too high, resulting in low product yield.

Method used

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  • Vibration sensor and electronic equipment
  • Vibration sensor and electronic equipment
  • Vibration sensor and electronic equipment

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Embodiment Construction

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0046] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0047] In the present in...

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PUM

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Abstract

The invention discloses a vibration sensor and electronic equipment, and the vibration sensor comprises a circuit board assembly, a housing, a vibration pickup assembly, a supporting shell and a chip assembly, and the housing covers one side of the circuit board assembly to form an installation space in a surrounding manner; the vibration pick-up assembly is arranged in the installation space and used for picking up external bone vibration to generate response vibration; the supporting shell is connected to the side, away from the circuit board assembly, of the vibration pickup assembly. The chip assembly is connected to the side, away from the circuit board assembly, of the supporting shell and electrically connected with the circuit board assembly. A conduction cavity is defined by the vibration pickup assembly, the supporting shell and the chip assembly, so that response vibration is transmitted to the chip assembly through the conduction cavity. According to the technical scheme, the structure of the vibration sensor is simplified, the machining difficulty and cost are reduced, and meanwhile the structural reliability of the vibration sensor is improved.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a vibration sensor and electronic equipment using the vibration sensor. Background technique [0002] The bone voiceprint sensor is a kind of sensor that uses the vibration of the diaphragm to instigate air flow, excites the MEMS diaphragm, and uses this to detect the flow signal, so the bone voiceprint sensor can be used for head and neck bones caused by human speech. The slight vibration is used to collect the sound signal and convert it into an electrical signal, which is different from the traditional microphone to collect sound through air conduction, so the sound can be transmitted with high clarity even in a very noisy environment. [0003] In the related art, the bone voiceprint sensor usually includes a vibration pickup unit and a microphone unit. The vibration pickup unit is used to pick up external bone vibration and transmits it to the microphone unit. The microphone ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01H11/06G01H11/08
CPCG01H11/06G01H11/08
Inventor 端木鲁玉田峻瑜方华斌
Owner GOERTEK MICROELECTRONICS CO LTD
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