Through hole filling manufacturing process of multilayer board

Abstract

The invention relates to a through hole filling manufacturing process of a multi-layer board. The through hole filling manufacturing process comprises the following steps of cutting and baking; in the inner layer circuit, the two inner copper foil layers are subjected to dry film pressing, exposure, development, etching and film stripping treatment, and manufacturing of the inner layer circuit is completed; two-sided pressing: respectively pressing an outer insulating layer and an outer copper foil layer on the two inner copper foil layers to form a four-layer plate; mechanical drilling is conducted, specifically, through holes used for interlayer communication are drilled in the four-layer plate through a drilling machine; pTH: depositing a layer of thin chemical copper on the inner wall of the through hole to realize in-hole conduction; a first outer layer line; filling holes and electroplating; performing grinding; plating copper for the second time; and performing second-time outer-layer circuit manufacturing to complete the manufacturing of the outer-layer circuit. According to the manufacturing process, the reliability of through hole copper plating is improved while the surface copper uniformity of a product is ensured, the pad blocking design of a blind hole is avoided, more design space is provided for customers, and the manufacturing cost is reduced.

Description

technical field [0001] The invention relates to the manufacture of multilayer boards, in particular to a manufacturing process for through hole filling of multilayer boards. Background technique [0002] Most of the existing multi-layer board products are designed with blind holes and POFV. The bottom of the blind hole design must have a pad. With the development of electronic technology and people's requirements for miniaturization and high precision of electronic products, the existence of the pad will affect the product wiring. , which severely restricts the utilization of space; and the combination of mechanical drilling and POFV technology will affect the reliability of the product and the uniformity of copper thickness, which is not conducive to the production of fine lines. Contents of the invention [0003] In order to overcome the above defects, the present invention provides a through-hole filling process for multi-layer boards, which ensures the uniformity of co...

AI Technical Summary

Problems solved by technology

[0002] Most of the existing multi-layer board products are designed with blind holes and POFV. The bottom of the blind hole design must have a pad. With the development of electronic technology and people's requirements for miniaturization and high precision of electronic products, the existence of the pad will affect the product wiring. , which severely restricts the utilization of space; and the combination of mechanical drilling and POFV technology will affect the reliability of the product and the uniformity of copper thickness, which is not conducive to the production of fine lines

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