Method for automatically picking up bulk components by full-automatic chip mounter during surface-mounting process
An automatic pick-up and placement machine technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of difficult loading of bulk devices, long preparation time, and low production efficiency, and achieve high productivity, convenient operation, and low cost.
Inactive Publication Date: 2018-02-02
常州萱娜电子科技有限公司
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Problems solved by technology
When picking up components during the placement process, the components are picked up by the placement machine in sequence through the operation of the feeder, and bulk components are not used in the production process; for special requirements, it is inevitable to use bulk components At the same time, it is required to re-braid the bulk devices. When braiding, there must be a braiding machine and a braiding substrate for the corresponding devices. For small batch production, there are problems of poor economy and long preparation time. At the same time, it is difficult to load bulk devices. And the production efficiency is low, therefore, it is necessary to improve
Method used
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[0014] Attached below figure 1 An embodiment of the present invention is described.
[0015] A method for a fully automatic placement machine to automatically pick up bulk components during the placement process, comprising the following steps:
[0016] 1) Put the bulk components 1 into the groove body 7 of the bulk material tray 2 adapted to it according to its size. The bulk material tray 2 has a disc body 6 on which several different sizes Tank body group 3, described tank body group 3 is made up of several tank bodies 7 with the same size, the edge plate 4 that blocks the notch at the lower end of the tank body 7 is fixed on the plate body 6, on the edge plate 4 The serial number 5 corresponding to the tank body 7 is made, the components 1 are placed from the end of the serial number 5 and there is no gap between adjacent components 1, and the number of components 1 in the tank body 7 with the same size is the same ;
[0017] 2) Place the bulk material tray 2 with the c...
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The invention provides a method for automatically picking up bulk components by a full-automatic chip mounter during the surface-mounting process. The method comprises the steps of placing the bulk components in grooves of bulk discs adaptive to the bulk components according to sizes of the bulk components; placing the bulk discs loaded with the components on a bulk placement region of the full-automatic chip mounter; inputting initial positions, tail positions, lines and rows of the components in the bulk discs into a control panel of the full-automatic chip mounter, and automatically calculating a pickup position of each component by the full-automatic chip mounter; and starting the full-automatic chip mounter to automatically pick up and surface-mount the components in the bulk discs. The full-automatic chip mounter is simple in structure, relatively high in reliability, simple in process, relatively low in cost and high in production rate, and is convenient to operate, labor and time are saved, the bulk components are convenient to load, and the process of automatically picking up the bulk components during the full-automatic surface-mounting process can be effectively met.
Description
technical field [0001] The invention relates to a method for a fully automatic chip mounter to automatically pick up bulk components during the chip mount process. Background technique [0002] In the fully automatic placement process, the packaging form of components is required to be coil or tube. When picking up components during the placement process, the components are picked up by the placement machine in sequence through the operation of the feeder, and bulk components are not used in the production process; for special requirements, it is inevitable to use bulk components At the same time, it is required to re-braid the bulk devices. When braiding, there must be a braiding machine and a braiding substrate for the corresponding devices. For small batch production, there are problems of poor economy and long preparation time. At the same time, it is difficult to load bulk devices. And the production efficiency is low, therefore, it is necessary to improve. Contents ...
Claims
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IPC IPC(8): H05K13/04
CPCH05K13/0404H05K13/028H05K13/043
Inventor 朱金平
Owner 常州萱娜电子科技有限公司