Leveling device for manufacturing printed circuit board

A technology for printed circuit boards and leveling devices, which is applied in the fields of printed circuits, printed circuit manufacturing, electrical components, etc., and can solve the problems of unstable overall device structure, unsatisfactory flattening effect of leveling devices, and prone to rocking boards, etc.

Active Publication Date: 2018-02-16
乐凯特科技铜陵有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the flattening device of the printed circuit board in the prior art has an unsatisfactory f

Method used

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  • Leveling device for manufacturing printed circuit board
  • Leveling device for manufacturing printed circuit board
  • Leveling device for manufacturing printed circuit board

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0020] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0021] refer to Figure ...

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Abstract

The invention discloses a leveling device for manufacturing a printed circuit board. The leveling device comprises a base. Four first support rods are symmetrically arranged on the base. The two firstsupport rods with corresponding positions are connected together with a fixing plate thereon. A fixing plate is fixedly connected between the two fixing plates. Two driving rollers are commonly connected rotatably between two fixing plates. Two driving rollers are commonly provided with a conveyor belt thereon. A PCB in process is arranged on the conveyor belt. Each of the fixing plate is fixedlyconnected with a first mounting plate and a second mounting plate on the upper surface. Each first mounting plate is rotatably connected with a first connecting rod and a rotating rod thereon. Each second mounting plate is rotatably connected with a second connecting rod thereon. The leveling device in the invention has the advantages of ingenious structure, convenient use, stable overall device,multiple flattening modes, good flattening effect, few occurrence of warping phenomenon, reduction of many hidden troubles in subsequent steps and unnecessary scrapping, reduction of production cost,and high promotion value.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a leveling device for manufacturing printed circuit boards. Background technique [0002] The printed circuit board is the provider of electrical connections for electronic components. The main advantage of using circuit boards is to greatly reduce the errors of wiring and assembly, and improve the level of automation and production labor rate. According to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. To make a multilayer printed circuit board according to the related technology, it is necessary to laminate the metal aluminum plate and the multilayer aluminum substrate. However, the flattening effect of the existing leveling device for printed circuit boards is not ideal, and the phenomenon of warping is prone to occur, and the ove...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0014H05K2203/0278
Inventor 沈志刚
Owner 乐凯特科技铜陵有限公司
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