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Device manufacturing method and manufacturing method of thin film micro device

A device manufacturing method and mask technology, applied in the field of micro devices, can solve the problem of unstable relative position between the mask plate and the substrate

Active Publication Date: 2018-02-23
芯知微(上海)电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a method for manufacturing a device and a method for manufacturing a thin-film micro-device, which can improve the problem of unstable relative positions between the mask plate and the substrate, and improve the quality of the device.

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  • Device manufacturing method and manufacturing method of thin film micro device
  • Device manufacturing method and manufacturing method of thin film micro device
  • Device manufacturing method and manufacturing method of thin film micro device

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Embodiment Construction

[0040] The device manufacturing method and the thin film micro device manufacturing method of the present invention will be described in more detail below in conjunction with schematic diagrams, wherein a preferred embodiment of the present invention is represented, it should be understood that those skilled in the art can modify the present invention described here, and still realize Advantageous effects of the present invention. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.

[0041] In the following description, it should be understood that when a layer (or film), region, pattern or structure is referred to as being "on" a substrate, layer (or film), region, pad and / or pattern, it may directly on another layer or substrate, and / or intervening layers may also be present. Further, it will be understood that when a layer is referred to as being 'under' another laye...

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Abstract

The invention discloses a device manufacturing method and a manufacturing method of a thin film micro device. The device manufacturing method comprises the steps that a substrate is provided; a firstelectrostatic adsorption electrode is formed on the substrate; a mask plate is provided; a second electrostatic adsorption electrode is formed on the mask plate; the mask plate is placed on the substrate; and polarization voltage is applied to the first electrostatic adsorption electrode and the second electrostatic adsorption electrode, so that the mask plate is electrostatically adsorbed and fixed on a processing surface. According to the invention, relative movement between the substrate and the mask is avoided, and the problem of unstable relative position is avoided; the required device can be accurately acquired; and the quality of the device can be improved.

Description

technical field [0001] The invention relates to the field of micro-device technology, in particular to a device manufacturing method and a thin-film micro-device manufacturing method. Background technique [0002] Traditional thin-film micro-device processing methods are usually inseparable from photolithography. A thin-film micro-device processing method based on photolithography technology, its core process steps include: first forming one or more layers of solid film on a solid substrate, then forming one or more layers of photoresist on the solid film, and then using The principle of photochemical reaction is to transfer the micro-device pattern to be processed to the photoresist to form an effective pattern window or functional pattern, and then use the remaining photoresist as a blocking pattern, and then use chemical or physical etching methods to etch away Part of the solid film is formed to form the required thin film micro device structure, and finally the remaini...

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Application Information

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IPC IPC(8): H01L51/56C23C14/04
CPCC23C14/042H10K71/164H10K71/166H10K71/00
Inventor 王晓川
Owner 芯知微(上海)电子科技有限公司