Improved radiator for light source with high integration level

Abstract

The invention discloses an improved radiator for a light source with the high integration level. The improved radiator comprises a radiator body, the radiator body comprises a plurality of radiating fins and a first bottom plate, and the radiating fins are connected with the first bottom plate; a second bottom plate is arranged under the first bottom plate; a plurality of heat pipes for heat conduction are arranged between the first bottom plate and the second bottom plate; the first bottom plate and / or the second bottom plate is provided with heat pipe grooves used for containing the heat pipes; the first bottom plate is provided with a plurality of ventilation openings communicating with the first bottom plate; and the second bottom plate is provided with ventilation grooves. According to the improved radiator for the light source with the high integration level, by additionally arranging the heat pipes and the ventilation grooves, the radiating performance is improved, and the purpose of quickly lowering the junction temperature of the light source with the high integration level is achieved. Compared with an original radiator for the light source with the high integration level, the radiator can lower the junction temperature of the light source with the high integration level by 10 DEG C more than the original radiator.

Description

technical field [0001] The invention relates to a heat sink, in particular to an improved heat sink for a light source with higher integration. Background technique [0002] A light source with a high degree of integration refers to a light source with a calorific value per unit area higher than 0.6w / cm, such as a chip-on-board (COB) light source and a dense patch (SMD) LED light source; Small, the heat is concentrated together, so that the junction temperature of the light source is higher; and only the aluminum profile heat sink faces integrated heat generation, and heat transfer is difficult, so a new type of heat transfer performance that can effectively improve heat transfer performance and heat dissipation performance is required. product. [0003] However, the existing aluminum profiles used for heat sinks with high integration light sources only dissipate heat through cooling fins. Faced with integrated heat generation, heat transfer is difficult, and it cannot effe...

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Problems solved by technology

[0002] A light source with a high degree of integration refers to a light source with a calorific value per unit area higher than 0.6w / cm, such as a chip-on-board (COB) light source and a dense patch (SMD) LED light source; Small, the heat is concentrated together, so that the junction temperature of the light source is higher; and only the aluminum profile heat sink faces integrated heat generation, and heat transfer is difficult, so a new type of heat transfer performance that can effectively improve heat transfer performance and heat dissipation performance is required. product

[0003] However, the existing aluminum profiles used for heat sinks with high integration light sources only dissipate heat through cooling fins. Faced with integrated heat generation, heat transfer is difficult, and it cannot effectively dissipate heat from light sources, that is, it cannot effectively reduce the high integration. The junction temperature of the light source

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