Heat dissipation device with height adjustment capacity

Abstract

The invention discloses a height-adjustable heat dissipation device, which comprises a base, a plurality of grooves are arranged on the top of the base, convex plates are arranged in the grooves, and a plurality of detachable heat dissipation devices are uniformly arranged on the convex plates. A plurality of slide grooves matched with the protruding plate are provided in the groove from bottom to top, the protruding plate is located in one of the chute grooves, and the protruding plate can move in the chute. According to the size of the electronic product, the position of the convex plate in the chute is selected, thereby changing the length of the heat sink protruding from the base to meet the use requirements of different electronic products; during the use or transportation of the heat sink, When the heat sink is bent, the convex plate can be unloaded from the base, and the heat sink on the convex plate is independently set, when one or more of them are damaged, only the damaged one needs to be removed from the convex plate for repair. Replacement, compared with the traditional replacement of the entire heat sink, saves costs.

Description

technical field [0001] The invention relates to a radiator, in particular to a radiator capable of height adjustment. Background technique [0002] Integrated circuits are heavily used in computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. The function of the radiator is to absorb the heat and then dissipate it inside or outside the case to ensure that the temperature of the computer components is normal. Most heat sinks absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distant place through various methods, such as the air in the chassis, and then the chassis transfers the hot air to the outside of the chas...

AI Technical Summary

Problems solved by technology

[0003] At present, most of the existing heat sinks are directly welded on the base of the heat sink, that is, the heat sink is fixed on the base, resulting in different sizes of electronic products need to make matching heat sinks, which cannot be changed according to the size of the electronic products The height of the heat sink, because the current radiator base and the heat sink are all welded together, when the radiator is maintained, because the distribution of each heat sink is relatively dense, it causes inconvenience to the maintenance personnel, and because the radiator is mostly Made of aluminum, the heat sink is easy to bend, and the entire heat sink needs to be replaced, which increases the maintenance cost

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