Low-temperature tab adhesive and preparation method thereof

A technology of ear glue and low temperature, applied in adhesives, final product manufacturing, sustainable manufacturing/processing, etc., can solve problems such as inapplicability, achieve the effect of ensuring stiffness, ensuring bonding strength, and reducing packaging temperature

Pending Publication Date: 2018-03-09
SHANGHAI ZIJIANG NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the commonly used ear glue generally has a melting point above 140°C. This kind of high melting point ear glue is not suitable for some aluminum-plastic film packages that use low-temperature heat-sealing technology.

Method used

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  • Low-temperature tab adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] figure 1 It is a schematic diagram of the structure of low-temperature tab glue. The low-temperature tab glue includes a first acid-modified resin outer layer 1, a tab rubber core layer 2, a second acid-modified resin outer layer 3, and the tab rubber core layer 2 is provided on the first Between an acid-modified resin outer layer 1 and a second acid-modified resin outer layer 3, the first acid-modified resin outer layer 1, the tab rubber core layer 2, and the second acid-modified resin outer layer 3 are sequentially compounded together.

[0031] The melting points of the first acid-modified resin outer layer 1, the tab rubber core layer 2, and the second acid-modified resin outer layer 3 are 101°C, 142°C, and 101°C, respectively.

[0032] The thickness ratio is: the first acid-modified resin outer layer 1: the lug rubber core layer 2: the second acid-modified resin outer layer 3=1:3:1, the first acid-modified resin outer layer 1, the lug rubber core layer 2 The total thickn...

Embodiment 2

[0044] figure 1 It is a schematic diagram of the structure of low-temperature tab glue. The low-temperature tab glue includes a first acid-modified resin outer layer 1, a tab rubber core layer 2, a second acid-modified resin outer layer 3, and the tab rubber core layer 2 is provided on the first Between an acid-modified resin outer layer 1 and a second acid-modified resin outer layer 3, the first acid-modified resin outer layer 1, the tab rubber core layer 2, and the second acid-modified resin outer layer 3 are sequentially compounded together.

[0045] The melting points of the first acid-modified resin outer layer 1, the tab rubber core layer 2, and the second acid-modified resin outer layer 3 are 139°C, 164°C, and 139°C, respectively.

[0046] The thickness ratio is: the first acid-modified resin outer layer 1: the lug rubber core layer 2: the second acid-modified resin outer layer 3=1:6:1, the first acid-modified resin outer layer 1, the lug rubber core layer 2 The total thickn...

Embodiment 3

[0058] figure 1 It is a schematic diagram of the structure of low-temperature tab glue. The low-temperature tab glue includes a first acid-modified resin outer layer 1, a tab rubber core layer 2, a second acid-modified resin outer layer 3, and the tab rubber core layer 2 is provided on the first Between an acid-modified resin outer layer 1 and a second acid-modified resin outer layer 3, the first acid-modified resin outer layer 1, the tab rubber core layer 2, and the second acid-modified resin outer layer 3 are sequentially compounded together.

[0059] The melting points of the first acid-modified resin outer layer 1, the tab rubber core layer 2, and the second acid-modified resin outer layer 3 are 139°C, 164°C, and 139°C, respectively.

[0060] The thickness ratio is: the first acid-modified resin outer layer 1: the lug rubber core layer 2: the second acid-modified resin outer layer 3=1:4:1, the first acid-modified resin outer layer 1, the lug rubber core layer 2 The total thickn...

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Abstract

The invention provides a low-temperature tab adhesive. The low-temperature tab adhesive comprises a first acid modified resin outer layer, a tab adhesive core layer and a second acid modified resin outer layer, wherein the tab adhesive core layer is arranged between the first acid modified resin outer layer and the second acid modified resin outer layer; the first acid modified resin outer layer,the tab adhesive core layer and the second acid modified resin outer layer are compounded together in sequence; and the smelting point of the tab adhesive core layer is higher than the smelting pointsof the first acid modified resin outer layer and the second acid modified resin outer layer. The invention further provides a preparation method of the low-temperature tab adhesive. According to thelow-temperature tab adhesive provided by the invention, an outer layer of the tab adhesive core layer adopts acid modified resin with a low smelting point, so that the bonding strength between the tabadhesive core layer and a metal tab is ensured and the packaging temperature of the tab adhesive also can be reduced; the packaging performance of the tab and an aluminum-plastic film of a low-temperature heat sealing technology is improved; and meanwhile, the stiffness of the tab adhesive can be ensured through a fixed-axis micro-tensile technology.

Description

Technical field [0001] The invention relates to a tab glue, in particular to a tab glue suitable for low-temperature heat sealing and a preparation method thereof. Background technique [0002] Tab glue is a material widely used in the field of lithium-ion batteries. The main function of the tab glue is to adhere to the tabs of the lithium ion battery, so that the tabs of the lithium ion battery have the performance of heat sealing with the PP layer (polypropylene layer) of the aluminum-plastic film. [0003] At present, the commonly used lug glue generally has a melting point above 140°C. This high-melting lug glue is not suitable for some aluminum-plastic film packaging that uses a low-temperature heat-sealing process. Summary of the invention [0004] The technical problem to be solved by the present invention is to provide a tab glue with a melting point not higher than 140 DEG C and suitable for low-temperature heat sealing and a preparation method thereof. [0005] In order to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01M10/058C09J7/10C09J7/30
CPCH01M10/058C09J7/00C09J2203/33C09J2400/22C09J2453/00C09J2301/208Y02E60/10Y02P70/50
Inventor 贺爱忠陈涛沈均平
Owner SHANGHAI ZIJIANG NEW MATERIAL TECH CO LTD
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