Non-solvent hot melt adhesive tape for contact smart card base and chip packaging

Abstract

The invention discloses a non-solvent hot melt adhesive tape for the contact smart card base and chip packaging. The hot melt adhesive tape comprises the following raw materials in parts by weight: 70-90 parts of a copolyamide as an adhesion main body raw material, 10-20 parts of a rubber as a toughening agent of the copolyamide, 5-15 parts of polyurethane as a tackifier of the copolyamide, 1-5 parts of EVA wax as a modifier of the copolyamide, 10-20 parts of a terpene resin as a tackifier, 0.5-1 part of an anti-oxidation agent, 4-8 parts of a chain-extending crosslinking agent, 4-8 parts of aflame retardant, 15-25 parts of nano silica, and 10-20 parts of titanium oxide. The hot melt adhesive tape uses polyurethane to increase the adhesion with a PVC layer, the packaging temperature is reduced, the specific melting temperature is low to 160-170 DEG C, and is lower than the market tape temperature by 30-50 DEG C, and thus the scalding of a PVC smart card base is effectively avoided. EVA wax is used as an auxiliary agent to increase the fluidity, the processing and forming is more excellent, the packaging time after applying is shorter, the heat-sealing time is shortened, and thus the card-making capacity is increased by 30-50%.

Description

technical field [0001] The invention relates to a hot-melt adhesive tape, in particular to a non-solvent hot-melt adhesive tape for contact smart card base and chip packaging. Background technique [0002] With the development of the electronic industry and wireless communication industry, the application field of chips has greatly increased, and the application of high-performance adhesives has become more and more extensive. As an important variety of adhesives, hot melt adhesives have characteristics that make their functions difficult to be replaced . Hot-melt adhesive has the following advantages: ① Hot-melt adhesive is a kind of plastic adhesive. Its physical state changes with temperature within a certain temperature range, but its chemical properties remain unchanged. It is non-toxic and tasteless, and is an environmentally friendly chemical product. ; ②It has its own softening point, and it can be used when it is heated to a certain temperature; ③Once it is heated ...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies in the prior art, the present invention provides a non-solvent hot-melt adhesive tape for contact-type smart card base and chip packaging, which can solve the defects of the existing hot-melt adhesive tape such as high melting temperature range and long heat-sealing time