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Preparation method of special hot melt adhesive tape for electronic chip packaging

A hot-melt tape and electronic chip technology, applied in film/sheet-like adhesives, adhesives, polymer adhesive additives, etc., can solve the problem of easily scalded chips, high melting temperature range, and long packaging time. problems, to avoid soldering methods, reduce processing procedures, and reduce packaging temperature.

Inactive Publication Date: 2021-01-15
东莞市新懿电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a preparation method of hot-melt adhesive tape for electronic chip packaging, which solves the problem that the current hot-melt adhesive tape has a high melting temperature range, a long time for packaging, a small thermal insulation coefficient, high temperature is easy to burn the chip, and there are many raw materials. It is an insulating material and does not conduct electricity. It can only be conducted by adding other materials

Method used

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Examples

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preparation example Construction

[0022] The invention provides a technical solution: a method for preparing a special hot-melt adhesive tape for electronic chip packaging, comprising the following steps:

[0023] Step 1: Raw material ratio Composition: It is composed of copolyamide, rubber, terpene resin, polyurethane, talcum powder, foaming agent, maleic anhydride grafted polyethylene wax, graphene, and the mass ratio of each raw material of the hot melt adhesive tape is respectively : Copolyamide 40-60%, rubber 10-15%, terpene resin 10-15%, polyurethane 5-10%, talcum powder 5-10%, foaming agent 4-5%, maleic anhydride grafted polyethylene Wax 1-5%, graphene 1-5%;

[0024] Step 2: Prepare semi-finished products: Add the weighed copolyamide, rubber, terpene resin, polyurethane, and maleic anhydride grafted polyethylene wax into the reactor, control the internal temperature of the reactor to rise to 70-140°C, and then Start stirring and mixing. When the temperature inside the reactor reaches above 200°C, the p...

Embodiment 1

[0030] A preparation method of a special hot-melt adhesive tape for electronic chip packaging, comprising the following steps:

[0031] Step 1: Raw material ratio Composition: It is composed of copolyamide, rubber, terpene resin, polyurethane, talcum powder, foaming agent, maleic anhydride grafted polyethylene wax, graphene, and the mass ratio of each raw material of the hot melt adhesive tape is respectively : Copolyamide 50%, rubber 15%, terpene resin 10%, polyurethane 10%, talcum powder 5%, foaming agent 4%, maleic anhydride grafted polyethylene wax 4%, graphene 2%;

[0032] Step 2: Prepare semi-finished products: Add the weighed copolyamide, rubber, terpene resin, polyurethane, and maleic anhydride grafted polyethylene wax into the reactor, control the internal temperature of the reactor to rise to 70-140°C, and then Start stirring and mixing. When the temperature inside the reactor reaches above 200°C, the polycondensation reaction starts. The temperature during the react...

Embodiment 2

[0039] A preparation method of a special hot-melt adhesive tape for electronic chip packaging, comprising the following steps:

[0040] Step 1: Raw material ratio Composition: It is composed of copolyamide, rubber, terpene resin, polyurethane, talcum powder, foaming agent, maleic anhydride grafted polyethylene wax, graphene, and the mass ratio of each raw material of the hot melt adhesive tape is respectively : Copolyamide 50%, rubber 10%, terpene resin 12%, polyurethane 10%, talcum powder 7%, foaming agent 3%, maleic anhydride grafted polyethylene wax 3%, graphene 5%;

[0041] Step 2: Prepare semi-finished products: Add the weighed copolyamide, rubber, terpene resin, polyurethane, and maleic anhydride grafted polyethylene wax into the reactor, control the internal temperature of the reactor to rise to 70-140°C, and then Start stirring and mixing. When the temperature inside the reactor reaches above 200°C, the polycondensation reaction starts. The temperature during the react...

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Abstract

The invention discloses a preparation method of a special hot melt adhesive tape for electronic chip packaging. The method comprises the following steps: proportioning the following raw materials: copolyamide, rubber, terpene resin, polyurethane, talcum powder, a foaming agent, maleic anhydride grafted polyethylene wax and graphene according to a mass ratio. The hot melt adhesive tape is preparedfrom the following components in percentage by weight: 40-60% of copolyamide, 10-15% of rubber, 10-15% of terpene resin, 5-10% of polyurethane, 5-10% of talcum powder, 4-5% of a foaming agent, 1-5% ofmaleic anhydride grafted polyethylene wax and 1-5% of graphene. According to the preparation method of the special hot melt adhesive tape for electronic chip packaging, a micro-foaming high polymer material is added, gas is generated after heating to foam to thicken an adhesive tape layer, a micropore structure is used for absorbing heat, the packaging temperature is reduced, the conductivity ofconductive graphene particles is used for enabling the hot melt adhesive to have the conductivity, a welding mode of a coil and a module is avoided, and processing procedures are reduced.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a preparation method of a special hot-melt adhesive tape for electronic chip packaging. Background technique [0002] With the development of the electronics industry and wireless communication industry, the application fields of electronic chips have greatly increased. As an important variety of adhesives, hot-melt tape is indispensable in the packaging process of electronic chips. [0003] For example, the application number is CN201910038068.1, which discloses a hot-melt adhesive tape and its preparation method. The present invention discloses a hot-melt adhesive tape and its preparation method. Compared with the performance of ordinary hot-melt tape in the technology, the performance of the hot-melt tape of the present invention is more superior, easy to paste, good retention, good toughness, good tensile effect, high tensile strength, and no fracture phenomenon. More...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/30C09J177/00C09J11/04C09J11/08C08J9/04
CPCC08J9/0061C08J9/0066C08J9/04C08J2377/00C08J2421/00C08J2445/00C08J2451/06C08J2475/04C08L2203/206C09J11/04C09J11/08C09J177/00C09J2203/326C09J2477/00C09J7/30C08L21/00C08L45/00C08L75/04C08L51/06C08K3/34C08K3/042
Inventor 刘准亮刘绵州谢浩杰彭代勇
Owner 东莞市新懿电子材料技术有限公司
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