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Methods and apparatus for self-alignment of integrated circuit dies

A bare-chip, water-based technology applied to circuits, record carriers used in machines, electrical components, etc., can solve the problems of increasing chip manufacturing costs, low throughput, and slowing down chip manufacturing

Pending Publication Date: 2018-03-13
MARVELL ASIA PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The low throughput of these machines not only slows down chip fabrication, but also increases the manufacturing costs associated with each chip due to the extended amount of time each IC die spends in the die mount machine and associated equipment

Method used

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  • Methods and apparatus for self-alignment of integrated circuit dies
  • Methods and apparatus for self-alignment of integrated circuit dies
  • Methods and apparatus for self-alignment of integrated circuit dies

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Embodiment Construction

[0020] Conventional techniques for reconfiguration in fan-out packaging typically rely on the mechanical capabilities of the die-bonding equipment to achieve the requisite level of precision. By way of review, the reconfigured process for fan-out packaging at the wafer or panel level involves singulating integrated circuit (IC) die from a silicon wafer and pairing the die by placing the die at a lower density on the substrate. It refactors. In some cases, the increased substrate area per die has resulted in shrinking die dimensions while enabling the same or greater number of interconnects through substrate, carrier, or die packaging. As noted above, conventional techniques for reconstitution rely on the mechanical capabilities of the die handling machinery to ensure high precision placement of the die during the reconstitution process. However, these mechanically dependent die bonding machines are slow and have low throughput, which in turn increases the manufacturing time a...

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PUM

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Abstract

The present disclosure describes apparatuses and techniques for self-aligning integrated circuit (IC) dies. In some aspects, a hydrophobic material is deposited on a surface of a substrate to form a pattern on the surface of the substrate. The pattern may expose areas of the substrate surface for placement of IC dies. A water-based solution is then applied to the exposed areas such that droplets form on the exposed areas of the substrate surface. IC dies are placed on the droplets of the water-based solution, which can cause the IC dies to align with the exposed areas of the substrate surface.The droplets are then caused to evaporate such that the IC dies settle on the exposed areas of the substrate surface.

Description

[0001] Cross References to Related Applications [0002] This disclosure claims priority to US Provisional Patent Application No. 62 / 383,921, filed September 6, 2016, the entire contents of which are incorporated herein by reference. Background technique [0003] The background description provided herein is for the purpose of generally presenting the context of the disclosure. Unless otherwise indicated, the approaches described in this section are not prior art to the claims in the present disclosure and are not admitted to be prior art by inclusion in this section. [0004] During most chip fabrication processes, integrated circuit (IC) die are singulated (eg, separated) from a silicon wafer and mounted to die carriers for subsequent processing. However, mounting an IC die to a die carrier often requires a level of high precision to ensure proper placement of the die relative to each other or the die carrier itself. Typical IC die attach equipment and machines rely on me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68H01L21/67
CPCH01L21/67011H01L21/6715H01L21/68H01L2224/29099H01L2224/83002H01L24/83H01L24/97H01L2224/83143H01L2224/83192H01L2224/95146H01L2224/97H01L2924/00014G06K19/07745H01L23/3157H01L24/16H01L24/24H01L24/82H01L24/96H01L25/0657H01L25/50
Inventor L-C·王M·雅各布斯
Owner MARVELL ASIA PTE LTD