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A mems direct pull direct compression type two-axis accelerometer chip and preparation method thereof

A technology of axial acceleration and direct pull and direct compression, which is applied in the direction of acceleration measurement using inertial force, can solve the problems affecting the improvement of acceleration sensors, achieve the effect of improving sensitivity and resonance frequency, and improving performance

Active Publication Date: 2019-10-11
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a mutual restriction relationship between the natural frequency and the sensitivity, which affects the further improvement of the acceleration sensor.

Method used

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  • A mems direct pull direct compression type two-axis accelerometer chip and preparation method thereof
  • A mems direct pull direct compression type two-axis accelerometer chip and preparation method thereof
  • A mems direct pull direct compression type two-axis accelerometer chip and preparation method thereof

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Embodiment

[0074] As a preferred embodiment of the present invention, the accelerometer chip of the present embodiment is made of SOI (Silicon on Insulator) silicon wafer: the whole structure is formed by four identical sensor subunits rotating around the center of the accelerometer chip, two in the same direction A group of sensor units measures the in-plane acceleration perpendicular to the direction. The chip frame 1 is fixed on the underlying glass plate 18 through a bonding process. The distance between the first and second mass blocks is the length of the sensitive beam 5; two sensitive beams 5 are arranged symmetrically on both sides of the hinge beam 4, and their two ends are respectively fixed on the first and second mass end of the block.

[0075] The process for preparing the in-plane MEMS piezoresistive two-axis accelerometer chip of this embodiment includes the following steps, combining Figure 6 :

[0076] Step 1, use the N-type (100) crystal surface to polish the SOI s...

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Abstract

The invention discloses an MEMS straight-pulling straight-pressing two-axis accelerometer chip and a preparation method thereof. The accelerometer chip is manufactured by adopting an SOI silicon waferand is formed by arranging four identical sensor sub-units around the center of the chip, wherein each sub-unit comprises mass blocks, support beams, sensitive beams, a hinge beam, wires and bondingpads, the mass blocks are connected with a chip frame through the support beams, two mass blocks are connected through the hinge beam, two sensitive beams are symmetrically distributed at two sides ofthe hinge beam, the wires are connected with the bonding pads to form a semi-open-loop Wheatstone full bridge circuit; and the chip frame is bonded on a bottom glass plate. One group of sensor sub-units measures the acceleration in the x-direction, and the other group measures the acceleration in the y-direction. The accelerometer chip can achieve separated measurement for two-axis acceleration below 100g, the intrinsic frequency is greater than 25kHz, the sensitivity is greater than 0.9mV / g / 3V under an amplification-free condition, and the accelerometer chip has good performance.

Description

technical field [0001] The invention belongs to the field of measurement of micromechanical electronic sensors, and in particular relates to a MEMS direct pull and direct pressure two-axis accelerometer chip and a preparation method thereof. Background technique [0002] The output of MEMS acceleration sensor is the mechanical measurement sensor second only to the pressure sensor, and it is one of the most widely used MEMS devices at present. MEMS piezoresistive acceleration sensor has simple structure, small appearance and superior performance, especially suitable for the measurement of low frequency acceleration. In addition to being used in aerospace for various overload and vibration parameter measurements such as aircraft wind tunnel tests and flight tests, it can also be used for testing vibration parameters at various stages of engine test benches in industry. [0003] The principle of the MEMS piezoresistive acceleration sensor is very similar to the traditional str...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/12
Inventor 赵立波于明智蒋维乐贾琛李支康王久洪赵玉龙蒋庄德
Owner XI AN JIAOTONG UNIV
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