Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate rotary apparatus and substrate alignment method

A technology of rotating device and substrate, applied in the field of PCB board manufacturing, can solve the problems of low printing efficiency and poor precision of PCB board, and achieve the effect of realizing automatic production, reducing production cost and reducing structural complexity.

Inactive Publication Date: 2018-04-06
JOINT STARS TECH
View PDF6 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, the technical problem to be solved by the present invention is to overcome the defects of low printing efficiency and poor precision of PCB boards in the prior art, thereby providing a substrate rotation device and a substrate alignment method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate rotary apparatus and substrate alignment method
  • Substrate rotary apparatus and substrate alignment method
  • Substrate rotary apparatus and substrate alignment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] Such as Figure 1-2 As shown, the present invention discloses a substrate adjustment device, which includes a detection device, a data analysis device, a control device and a substrate rotation device, wherein the detection device is used to detect the initial position of the substrate, the data analysis device is connected to the detection device, and the data analysis The device analyzes the initial position information collected by the detection device and compares it with the predetermined position. The control device is connected to the data analysis device and the substrate rotation device respectively, and controls the substrate rotation device to perform corresponding operations according to the control instructions issued by the data analysis results. The ground adjustment action finally adjusts the substrate to the predetermined position.

[0087] The substrate rotation device of the present invention includes a base 1, a working platform 2, a driving device a...

Embodiment 2

[0099] This embodiment is a method for aligning a substrate by using the rotating device in Embodiment 1 to align the substrate, which mainly includes the following steps:

[0100] S1: Firstly, the initial position of the substrate is detected by the detection device; for example, the mark points on the substrate can be sequentially captured by the CCD camera, and then the initial position information of the substrate can be calculated and analyzed.

[0101] S2: Send the initial position information of the substrate detected by the CCD camera to the data analysis device, and the data analysis device compares and analyzes the initial position of the substrate with the predetermined position, and sends the analysis result to the control device, such as a PLC control device.

[0102] S3: The control device performs an alignment adjustment operation on the substrate according to the comparative analysis result of the data analysis device, and the substrate reaches a predetermined p...

Embodiment 3

[0116] Embodiment 3 is a kind of printing method of PCB board, and it comprises the steps:

[0117] S1: adopt the substrate alignment method as in embodiment 2 to perform automatic alignment operation on the PCB board;

[0118] S2: After the alignment is completed, input the PCB board into the printing device for printing operation.

[0119] Moreover, the printing operation of the previous PCB board and the alignment operation of the latter PCB board are carried out simultaneously, thereby improving the efficiency of PCB production and increasing the production capacity of the production line.

[0120] The substrate rotation device provided by the present invention satisfies the adjustment requirements of linear movement, rotation and rotational offset required in the substrate alignment adjustment process by being provided with linear actuation modules that can move independently or in combination in two linear directions. The θ-axis rotating motor that needs to be additiona...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed is a substrate rotary apparatus. The substrate rotary apparatus comprises a substrate and a working platform, wherein the working platform is used for supporting the substrate; at least onedriving apparatus used for driving the working platform to move is arranged between the top surface of the substrate and the bottom surface of the working platform; the driving apparatus comprises a driving mechanism and a guiding mechanism; the guiding mechanism comprises a linear guiding mechanism for guiding the working platform to move within a horizontal plane, and a supporting rotary mechanism; the supporting rotary mechanism is connected with the linear guiding mechanism and the working platform; and by virtue of combination use of the driving apparatus, the working platform is controlled to perform linear translation and / or rotation and / or rotation offset. By virtue of the substrate rotary apparatus provided by the invention, structural complexity is lowered, and meanwhile, production efficiency and control precision are improved.

Description

technical field [0001] The invention relates to the technical field of PCB board manufacturing, in particular to a substrate rotating device and a substrate alignment method. Background technique [0002] At present, the alignment of the PCB board usually includes two types: one is to realize the movement of the PCB board through the X and Y two-axis movement; direction of movement. However, the dual-axis moving device cannot fully realize the fully automatic alignment of the PCB board, so the actual utilization rate is low; while the θ axis of the PCB board moving device in the prior art is mostly realized by direct rotation or by using a belt, etc., the structure is complex and requires many Cascade linkage, multi-stage linkage or transmission make the mechanism complex, the alignment accuracy is low, and the device volume is large; multiple positioning is required to meet the requirements of PCB board printing (or printing), thus greatly reducing the efficiency of automa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00
CPCH05K3/0008H05K2203/013H05K2203/0165H05K2203/166
Inventor 宋卫华成斌何凤雷
Owner JOINT STARS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com