Substrate processing equipment

Abstract

The present invention relates to a substrate processing device, in particular to a substrate processing device which uses plasma to form a plurality of concavo-convex portions on the surface of a substrate. The invention discloses a substrate processing device, which is characterized in that it comprises: a process chamber (100) with an upper side opening; a grounded upper cover (120); and a substrate supporting portion (130), disposed in the process chamber (100), applying a plurality of RF power sources, and supporting a tray (20) on which a plurality of substrates (10) are placed; and a gas injection part (140), which is arranged on the upper side of the processing space (S), and injects gas for performing substrate processing; and a tray cover part (150), which is arranged in the process chamber so as to be movable up and down (100), forming a plurality of openings (152), allowing the gas injected by the gas injection unit (140) to flow in; When the tray (20) is loaded into and removed from the process chamber (100), it is interfered, and the tray cover (150) is moved up and down; The cover part (150) and the upper cover plate (120) are electrically connected.

Description

technical field [0001] The present invention relates to a substrate processing apparatus (Substrate processing apparatus), in particular to a substrate processing apparatus that uses plasma to form a plurality of concavo-convex portions on the surface of a substrate. Background technique [0002] The substrate processing device is a device composed of a vacuum chamber and a substrate support frame. The vacuum chamber forms a closed internal space. The substrate support frame is installed in the vacuum chamber to place the substrate. While injecting processing gas into the internal space, applying The power source thus etches or deposits the surface of the substrate. [0003] The substrates processed by the substrate processing apparatus include wafers for semiconductors, glass substrates for LCD panels, substrates for solar energy, and the like. [0004] As an example of the above-mentioned substrate processing apparatus, there is a substrate processing apparatus in which a...

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Problems solved by technology

[0009] However, the conventional substrate processing equipment transfers the protective member on the insulator tray, and when the RF power is applied, there is no electrical connection with other parts in the chamber during the process, so that the protective member is energized and floated in the process chamber. In the (floating) state, plasma is formed in spaces other than the space between the protection parts and the tray, resulting in a problem of low process efficiency

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