Waste PCB electronic component lossless automatic separating equipment and control method thereof

A technology of electronic components and PCB boards, which is applied in the field of non-destructive automatic separation devices for waste PCB board electronic components. Good safety, guaranteed vibration and separation effects, and improved integrity

Active Publication Date: 2018-04-20
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing problems are: the impact force is directly applied to the soldering surface of the PCB board, which makes the circuit board

Method used

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  • Waste PCB electronic component lossless automatic separating equipment and control method thereof
  • Waste PCB electronic component lossless automatic separating equipment and control method thereof
  • Waste PCB electronic component lossless automatic separating equipment and control method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0040] See figure 1 In this embodiment, the structure of the non-destructive automatic separation equipment for waste PCB board electronic components is that the separation equipment is arranged in a "one" character, from left to right are feeding device 1, heating device 2, separation device 3, and discharging device 4 .

[0041] The feeding device 1 and the discharging device 4 are both belt conveyors. The PCB board with electronic components is fed into the heating device 2 through the feeding device 1 to raise the temperature of the welding surface, and then the electronic components are separated by the separating device 3. The generated PCB light boards and electronic components are respectively transported and discharged in the discharging device 4 by transmission belts at different height levels.

[0042] Such as figure 1 with figure 2 As shown, the heating device 2 in this embodiment supports a tin furnace 6 with adjustable temperature on the tin furnace frame 5. The tin ...

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PUM

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Abstract

The invention discloses waste PCB electronic component lossless automatic separating equipment. The waste PCB electronic component lossless automatic separating equipment is characterized in that theseparating equipment is arranged in a straight line manner and is sequentially provided with a feeding device, a heating device, a separating device and a discharging device from left to right; the feeding device and the discharging device are belt conveyors, a PCB with electronic components falls into the heating device through the feeding device to heat a welding face, then the separating deviceis used for separating the electronic components, and the empty PCB and the electronic components which are generated through separation are located on conveying belts on different height layers in the discharging device to be transferred and discharged. The waste PCB electronic component lossless automatic separating equipment is good in comprehensive performance, high in controllability, high in solder recovery purity, capable of guaranteeing the perfect and lossless electronic components and the complete empty PCB, and safe and reliable in operation.

Description

technical field [0001] The invention relates to a non-destructive automatic separation device for waste PCB board electronic components, in particular to an automatic equipment based on electronic component reuse and integral non-destructive disassembly. Background technique [0002] Printed Circuit Board (PCB for short) generally consists of three parts: substrate, electronic components and solder. With the acceleration of the upgrading of electrical and electronic products, the amount of electronic waste including PCB boards is increasing. Among all kinds of waste electrical and electronic products, the electronic components on the PCB board are electronic wastes that are easy to pollute the environment, and at the same time have a high recycling value. On the one hand, some of the dismantled electronic components can be directly used in new products or low-end electronic products after proper treatment; on the other hand, separating electronic components before disposal ...

Claims

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Application Information

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IPC IPC(8): B23K1/018B23K3/00B23K3/08
CPCB23K1/018B23K3/00B23K3/08B23K2101/42
Inventor 王玉琳刘冀陈子涵
Owner HEFEI UNIV OF TECH
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