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Process for manufacturing wiring substrate

A wiring substrate and manufacturing method technology, which is applied in the fields of printed circuit manufacturing, semiconductor/solid-state device manufacturing, chemical/electrolytic method to remove conductive materials, etc., can solve the problem of insufficient electrical connection between connection pads and solder balls, and difficulty in reliable fixing Problems such as electrical connection of electrode terminals of electronic components

Active Publication Date: 2018-04-27
MITSUBISHI PAPER MILLS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The opening of the solder resist layer using this method has an SMD structure, and the connection pad is covered by the solder resist layer around it. Therefore, it is difficult to reliably fix the electrode terminal of the electronic component and the electrical connection of the corresponding connection pad. connection, there is insufficient electrical connection between the connection pad and the solder ball

Method used

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  • Process for manufacturing wiring substrate
  • Process for manufacturing wiring substrate
  • Process for manufacturing wiring substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0181]

[0182] The circuit board 1 (170 mm x 200 mm in area, 15 µm in conductor thickness, and 0.4 mm in substrate thickness) was fabricated using the semi-additive method. Conductor wiring with a line width of 25 µm and a pitch of 50 µm exists on the surface (first surface) side, serving as connection pads 3 for connecting electronic components. On the back (second surface) side, a circular conductor wiring with a diameter of 600 µm serving as the connection pad 4 for external connection is formed. Next, a solder resist film with a thickness of 25 µm (manufactured by Sun Ink Manufacturing Co., Ltd., trade name: PFR-800 AUS410) was vacuum thermocompression-bonded to both sides of the above-mentioned circuit board 1 by vacuum lamination (lamination temperature 75°C, suction time 30 seconds, pressurization time 10 seconds). Thus, the solder resist layer 2 is formed. In the solder resist layer 2 on the first surface, the thickness from the surface of the insulating layer 8 i...

Embodiment 2）

[0197] Process (A) - process (D) were implemented by the method similar to Example 1 except having switched the order of process (C1) and process (C2). As a result of observation with an optical microscope, no residue of the solder resist layer 2 was found on either the connection pads 3 for electronic component connection or the connection pads 4 for external connection on the first surface and the second surface. In addition, on the first surface, the solder resist layer 2 is filled between the connection pads 3 for electronic component connection up to 5.5 µm below the surface of the connection pads 3 for electronic component connection. Photopolymerization on the surface of the solder resist layer 2 between the connection pads 3 for electronic component connection is suppressed by the non-contact exposure in an oxygen atmosphere in the step (C3), and as a result, the thickness of the solder resist layer 2 is reduced by 0.5 µm.

[0198] Next, in order to cure the solder re...

Embodiment 3）

[0201] By making the exposure amount in step (C3) 200mJ / cm 2 Other than that, the process (A) - process (D) were implemented by the method similar to Example 1. As a result of observation with an optical microscope, no residue of the solder resist layer 2 was found on either the connection pads 3 for electronic component connection or the connection pads 4 for external connection on the first surface and the second surface. On the first surface, the solder resist layer 2 is filled between the connection pads 3 for electronic component connection up to 6.0 µm below the surface of the connection pads 3 for electronic component connection. Photopolymerization on the surface of the solder resist layer 2 between the connection pads 3 for electronic component connection is suppressed by the non-contact exposure under an oxygen atmosphere in the step (C3), and as a result, the thickness of the solder resist layer 2 is reduced by 1.0 µm.

[0202] Next, in order to cure the solder re...

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Abstract

The present invention is a manufacturing method for a wiring board, which is characterized in including steps for: (A) forming solder mask layers of different thickness on both surfaces of a circuit board; (C1) for a solder mask layer of a first surface which is of thinner thickness than a solder mask layer of a second surface, exposing portions other than areas to be thinned in step (B), which isa later step; (C2) for the solder mask layer of the second surface, exposing portions other than areas to be developed in step (D), which is a later step; (B) by way of a thin-film processing solution, thinning the solder mask layer of the first surface of the non-exposed portions until reaching thicknesses that are less than or equal to connection pads; (C3) for the solder mask layer of the first surface, exposing the area-portions that have been thinned in step (B); and (D) removing, by way of a developer solution, the solder mask layers of the non-exposed portions of the second surface.

Description

technical field [0001] The present invention relates to a method of manufacturing a wiring board, and more specifically to a method of manufacturing a wiring board having a plurality of connection pads for connecting electronic components such as semiconductor chips and other printed wiring boards. Background technique [0002] A wiring board inside various electric devices has a circuit board having an insulating layer and conductor wiring formed on the surface of the insulating layer on one or both sides thereof. In addition, on the surface of the circuit board of the wiring board, a solder resist layer is formed on the entire surface of the unsoldered portion in order to prevent solder from adhering to conductor lines that do not require soldering. The solder resist layer fulfills the roles of oxidation prevention, electrical insulation, and protection of the conductor wiring from the external environment. [0003] Also, when electronic components such as semiconductor c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06H05K3/28
CPCH05K3/06H05K3/28H05K3/288H05K2203/0104H05K2203/0502H01L21/4857H01L23/49822H01L2924/0002H05K3/3452H05K2201/09845H01L2924/00
Inventor 丰田裕二后闲宽彦川合宣行中川邦弘
Owner MITSUBISHI PAPER MILLS LTD
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