Curved surface image sensor, and welding structure of circuit board and camera module thereof

An image sensor and welding structure technology, applied in the field of photography, can solve problems such as unfavorable thinning of the camera module, difficult design, and 3' length of the binding wire, etc., and achieves the effect of small space, light and thin, and simplified design.

Inactive Publication Date: 2018-05-04
TRULY OPTO ELECTRONICS
5 Cites 3 Cited by

AI-Extracted Technical Summary

Problems solved by technology

However, if figure 1 As shown, the first welding PAD 11' on the curved surface image sensor 1' still follows the design of the planar image sensor and is arranged on its photosensitive surface, which causes it to be bound to the second welding PAD...
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Method used

This welding structure moves the first welding PAD 11 of the curved surface image sensor 1 from the existing photosensitive surface 12 to the welding surface 13, facing the second welding PAD 21 on the circuit board 2, so that When the curved surface image sensor 1 is electrically connected ...
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Abstract

The invention discloses a curved surface image sensor, and a welding structure of a circuit board and a camera module thereof. The curved surface image sensor comprises a photosensitive surface and awelding surface, which are opposite to each other, wherein the photosensitive surface is an inward concave curved surface, and the welding surface is an outward convex surface and is provided with atleast a first welding PAD. When the surface image sensor is electrically connected with the circuit board, it has the advantages of short connection distance, small connection impedance, low impedanceloss, and low design difficulty and the like, and the occupied space is small, which is beneficial to the light weight and thinness of the camera module.

Application Domain

Technology Topic

Image

  • Curved surface image sensor, and welding structure of circuit board and camera module thereof
  • Curved surface image sensor, and welding structure of circuit board and camera module thereof
  • Curved surface image sensor, and welding structure of circuit board and camera module thereof

Examples

  • Experimental program(3)

Example Embodiment

[0022] Example one
[0023] Such as figure 2 As shown, a curved image sensor 1 includes a photosensitive surface 12 and a welding surface 13 opposite to each other. The photosensitive surface 12 is a concave curved surface, and the welding surface 13 is a convex curved surface and is provided with at least one first welding PAD 11.
[0024] Depending on the welding method between the curved image sensor 1 and the circuit board 2, the first welding PAD 11 can be arranged at any position on the welding surface 13, but for the convenience of welding, the first welding PAD 11 is preferably Set on the edge of the welding surface 13.

Example Embodiment

[0025] Example two
[0026] Such as Figure 3-5 As shown, a welding structure of a curved image sensor 1 and a circuit board 2 includes a circuit board 2, a curved base 4, and the above-mentioned curved image sensor 1, from bottom to top. The circuit board 2 faces the curved image sensor 1 At least one second welding PAD 21 is provided on one surface; the curved base 4 includes a bottom surface and a top surface opposite to each other, the bottom surface of which is a flat surface for mounting it on the circuit board 2, and the top surface is concave The curved surface is used to set the welding surface 13 of the curved image sensor 1; there is a one-to-one correspondence between the first welding PAD 11 on the curved image sensor 1 and the second welding PAD 21 on the circuit board 2 connection.
[0027] The welding structure moves the first welding PAD 11 of the curved image sensor 1 from the existing photosensitive surface 12 to the welding surface 13, facing the second welding PAD 21 on the circuit board 2, so that the curved surface When the image sensor 1 is electrically connected to the circuit board 2, it can reduce the connection distance, reduce the connection impedance, reduce the impedance loss, simplify the design, etc., and the space occupied by the electrical connection is small, which is beneficial to the camera module The thinness of the group.
[0028] In one embodiment, such as image 3 As shown, the corresponding first welding PAD 11 and the corresponding second welding PAD 21 are electrically connected by bonding wires 3.
[0029] In another embodiment, such as Figure 4 with 5 As shown, an integrated connecting circuit 5 is fabricated on the curved base 4, and the corresponding first welding PAD 11 and the second welding PAD 21 are electrically connected to the connecting circuit 5 by welding respectively.
[0030] The connecting circuit 5 includes at least one first welding position 51 for welding the first welding PAD 11 on the curved image sensor 1, and at least one first welding position 51 for welding the second welding PAD 21 on the circuit board 2. The two welding positions 53 and at least one connecting portion 52 connecting the corresponding first welding position 51 and the second welding position 53.
[0031] The connecting circuit 5 can be integrated on the curved base 4 by using processes such as injection molding, LDS or MID.
[0032] Among them, such as Figure 4 As shown, the first welding position 51 is arranged on the top surface of the curved base 4, the second welding position 53 is arranged on the bottom surface of the curved base 4, and the connecting portion 52 is removed from the The top surface of the curved base 4 is routed through the side surface of the curved base 4 to the bottom surface of the curved base 4.
[0033] Or like Figure 5 As shown, the first welding position 51 is arranged on the top surface of the curved base 4, the second welding position 53 is arranged on the bottom surface of the curved base 4, and the connecting portion 52 is removed from the The top surface of the curved base 4 is routed through the inside of the curved base 4 to the bottom surface of the curved base 4.
[0034] The circuit board 2 is a PCB.

Example Embodiment

[0035] Example three
[0036] A camera module includes the welding structure of the curved image sensor 1 and the circuit board 2 described in the second embodiment.
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PUM

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Description & Claims & Application Information

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