Semiconductor wafer wet cleaning equipment
A wet cleaning, semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem that equipment is difficult to perform multi-menu cleaning at the same time, and achieve the effect of reducing production costs, efficient utilization, and resource saving
Inactive Publication Date: 2018-05-11
ZING SEMICON CORP
View PDF6 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0008] In view of the prior art described above, the purpose of the present invention is to provide a semiconductor wafer wet cleaning equipment, which is used to solve the problem that the semiconductor wafer wet cleaning equipment in the prior art is difficult to perform multi-menu cleaning at the same time
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0036] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.
[0037] It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic ideas of the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the compo...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a semiconductor wafer wet cleaning equipment, which comprises two columns of washing tanks, a buffer tank, a carrying mechanism and a control module, wherein the two columns ofwashing tanks are placed in parallel and perform a wet cleaning operation on wafers according to the control of the control module; the buffer tank is located between the two columns of washing tanks,serves as a buffer region for conveying the wafers between the washing tanks and receives the wafers or a dripping liquid of a wafer box; and the carrying mechanism carries a wafer or wafer box to aspecified washing tank or stays in the buffer tank to wait according to the control of the control module. The semiconductor wafer wet cleaning equipment solves problems existing in switching among multiple recipes in the prior art, can realize simultaneous cleaning of multiple recipes, enables the equipment to be efficiently utilized, can effectively save resources and reduces the production cost.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor wafer wet cleaning device. Background technique [0002] The semiconductor manufacturing process is the key to realizing the transition from materials to discrete devices or integrated systems, and the cleaning process is the most commonly used process step. [0003] The traditional semiconductor wafer wet cleaning machine is a single row slot cleaning machine, that is, there is one or more slots between the upper area (Loader) and the lower area (Unloader), and each slot can use the required acid according to the design specifications or requirements. Liquid, lye, pure water, etc. for cleaning or rinsing, generally will be dried in a drying tank before unloading. A general cleaning machine is equipped with a transport mechanism to automatically transport wafers or wafer cassettes loaded with wafers between different slots. [0004] Tradition...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L21/67
CPCH01L21/67023H01L21/67173
Inventor 赵厚莹
Owner ZING SEMICON CORP