Substrate support apparatus, substrate treating system including same, and substrate treating method
A support device and support plate technology, which is applied to the original for photomechanical processing, photoplate process of patterned surface, optics, etc., can solve problems such as uneven liquid film, uneven internal temperature of liquid film, process degradation, etc.
Active Publication Date: 2018-05-11
SEMES CO LTD
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Problems solved by technology
However, since the temperature of the substrate gradually increases or decreases from the center of the substrate to the peripheral area, the internal temperature of the liquid film is not uniform and thus gradually increases toward the outside, or gradually increases and then decreases.
[0006] Uneven internal thickness of the liquid film can lead to process degradation
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[0040] Hereinafter, exemplary embodiments of the present inventive concept will be described in more detail with reference to the accompanying drawings. The embodiments of the inventive concept may be modified in various forms, and the scope of the inventive concept should not be construed as being limited to the following embodiments. Several embodiments of the inventive concept are provided to more fully describe the inventive concept to those skilled in the art. Therefore, the shapes of components in the drawings are exaggerated to emphasize their clearer description.
[0041] The system of the present embodiment of the inventive concept may be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the system of the present embodiment can be connected to an exposure device to perform a coating process and a developing process on a substrate. However, in the present embodiment, any device that c...
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Embodiments of the inventive concept relate to an apparatus for supporting a substrate and a method for treating a substrate. The substrate support apparatus includes a substrate support member including a support plate having an upper surface that supports a substrate, and a heating member provided in the support plate to heat the substrate, wherein an area of the support plate has a buffer area,in which a buffer space for restricting a heat transfer rate of heat provided from the heating member to the upper surface is formed. The buffer space insulates a central area and a peripheral area,thereby maximizing a temperature difference between the central area and the peripheral area.
Description
technical field [0001] Embodiments of the inventive concept relate to a substrate processing apparatus and a method for processing a substrate. Background technique [0002] Various processes such as cleaning, deposition, photolithography, etching, and ion implantation are performed to manufacture semiconductor devices. Among these processes, a coating method is used as a process for forming a liquid film on a substrate. Generally, the coating process is performed by treating A process in which a liquid is applied to a substrate to form a liquid film. [0003] A baking process of baking the substrate is performed before and after forming the liquid film on the substrate. The baking process is a process of heating a substrate above a process temperature in a closed space and stabilizing a liquid film by spreading an organic material on the liquid film. The baking process heats the entire area of the substrate to a uniform temperature, and different areas of the substrate ...
Claims
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Login to View More IPC IPC(8): H01L21/687H01L21/67G03F7/40G03F7/38
CPCG03F7/38G03F7/40H01L21/67063H01L21/67098H01L21/68785H01L21/67109H01L21/67178H01L21/6719H01L21/67248H01L21/67103H01L21/324H01L21/6835G03F1/68H01L21/02118H01L21/02282H01L21/02318H01L21/0273H01L21/68714
Inventor 金载烈徐钟锡金性洙
Owner SEMES CO LTD