Curable resin composition for release sheet, release sheet, processing base material using same, and method for protecting base material

A technology of curable resin and peeling sheet, which is applied in the direction of chemical instruments and methods, synthetic resin layered products, coatings, etc., and can solve the problems of not being easy to peel off

Active Publication Date: 2018-05-11
NOF CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, when the substrate in a masked state is directly plated, the resin is

Method used

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  • Curable resin composition for release sheet, release sheet, processing base material using same, and method for protecting base material
  • Curable resin composition for release sheet, release sheet, processing base material using same, and method for protecting base material
  • Curable resin composition for release sheet, release sheet, processing base material using same, and method for protecting base material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0081] Next, although an Example and a comparative example are given and this invention is demonstrated further concretely, this invention is not limited to these Examples and a comparative example. Each component used in this Example and a comparative example is as follows. In addition, Mw represents a weight average molecular weight.

[0082]

[0083] (A-1, Mw:372)

[0084] [chemical formula 6]

[0085]

[0086] (A-2, Mw:399)

[0087] [chemical formula 7]

[0088]

[0089] (A-3, Mw:526)

[0090] [chemical formula 8]

[0091]

[0092] (A-4, Mw:488)

[0093] [chemical formula 9]

[0094]

[0095] (A-5, Mw:784)

[0096] [chemical formula 10]

[0097]

[0098] (A-6, Mw:416)

[0099] [chemical formula 11]

[0100]

[0101] (A-7, Mw:785)

[0102] [chemical formula 12]

[0103]

[0104] (A-8, Mw:1584)

[0105] [chemical formula 13]

[0106]

[0107]

[0108] (B-1, Mw:5000)

[0109] [chemical formula 14]

[0110]

[0111] n is 13 on av...

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PUM

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Abstract

A curable resin composition for a release sheet containing (A) a polyfunctional thiol compound having a weight average molecular weight of 200-2000 and (B) a polyfunctional (meth)acrylate having a weight average molecular weight of 200-50,000, in which the mass ratio ((A)/(B)) of component (A) and component (B) is 0.05-30, a processing base material using the same, and a method for protecting a base material.

Description

technical field [0001] The present invention relates to a curable resin composition for a release sheet capable of obtaining a release sheet excellent in adhesiveness and flexibility by curing. In addition, the present invention also relates to a processing base material having a release sheet, wherein the release sheet can be obtained by curing a curable resin composition for a release sheet. Furthermore, the present invention relates to a method of protecting a base material, wherein a release sheet obtained by curing a curable resin composition for a release sheet can be used as a protective layer. Background technique [0002] Conventionally, in the production process of precision components such as electronic materials, a release sheet has been used in order to protect the surface of the substrate (see, for example, JP-A-2001-247832). But most of them have to be aligned with the base material and cut off the release sheet, thus generating parts that are not used and di...

Claims

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Application Information

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IPC IPC(8): C09D4/02B32B27/00C08G75/045C08J5/18C09D5/20
CPCB32B27/00C08G75/045C08J5/18C09D5/20B32B27/308C08F2/50C08F220/38C08K5/17C08L33/14
Inventor 幸田一洋藤村俊伸土屋宏充
Owner NOF CORP
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