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Groove curvature measurement method and device, defect number prediction method and device

A measurement method and curvature technology, applied in the field of groove curvature measurement, can solve problems such as low accuracy, large error, and inability to carry out quantitative evaluation, and achieve high accuracy, realize the number of defects, and realize the effect of processing results

Active Publication Date: 2020-03-13
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the prior art, the measurement of the bending degree of the etched trench is mainly by visual observation after taking the topographic image of the trench, which cannot be quantitatively evaluated, with large errors and low accuracy.

Method used

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  • Groove curvature measurement method and device, defect number prediction method and device
  • Groove curvature measurement method and device, defect number prediction method and device
  • Groove curvature measurement method and device, defect number prediction method and device

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Embodiment Construction

[0071] Embodiments of the technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, so they are only examples, and should not be used to limit the protection scope of the present invention.

[0072] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application shall have the usual meanings understood by those skilled in the art to which the present invention belongs.

[0073] Embodiments of the present invention provide a method and device for measuring groove curvature, and a method and device for predicting the number of defects. The embodiments of the present invention will be described below with reference to the accompanying drawings.

[0074] Please refer to figure 2 , which shows a flow chart of a groove curvature measurement method pro...

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Abstract

The invention provides a trench curvature measurement method, a trench curvature measurement device, a defect number prediction method and a defect number prediction device. The trench curvature measurement method includes the following steps that: the topography image of an area to be measured is obtained; the roughness of a trench in the area to be measured is determined according to the topography image; and the curvature of the trench of the area to be measured is determined according to the roughness. Compared with the prior art, the trench curvature measurement method of the present invention realizes the automatic quantitative measurement of the curvature of the trench by utilizing the topography image, and has higher accuracy.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method and device for measuring groove curvature, and a method and device for predicting the number of defects. Background technique [0002] Etching is an important step in semiconductor manufacturing process, microelectronic IC manufacturing process and micro-nano manufacturing process. A general term for stripping and removing material by means of trench etching is a very common application in the etching process. In order to improve the integration of semiconductor devices, a variety of double patterning processes have been proposed in the industry, among which the self-aligned double patterning (Self-Aligned Double Patterning, SADP) process is one of them, and the self-aligned double patterning process is also called Self-aligned double trench etching process, Figure 1(a), Figure 1(b) and Figure 1(c) show the key nodes of the self-aligned double trench etching proc...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/24
CPCG01B11/24
Inventor 张彪芈健邵克坚王琨乐陶然陈保友
Owner YANGTZE MEMORY TECH CO LTD