Protective film bonding device and method
A bonding device and protective film technology, applied in packaging and other directions, can solve the problems of indentation on the product surface, expensive equipment, piercing of OLED or TFE film layers, etc., to avoid the generation of air bubbles, indentation and folding Injury, reduce the effect of the probability of air bubbles
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0029] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0030] refer to figure 1 and figure 2 , the protective film bonding device of the embodiment of the present invention includes a stage 10, a pressure plate 20, a lifting mechanism 30 and an upper shell 40, the stage 10 is used to place the substrate 1 to be filmed, the pressure plate 20 is arranged opposite to the stage 10, and The pressing plate 20 is arranged above the stage 10, and includes a plurality of first grooves 21 for air to pass through, a first channel 22 communicating with all the first grooves 21, and a first air inlet 23 on the surface facing the stage 10. An air inlet 23 and ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com