A method of measuring the contact resistance of a solderless press-in connection

Abstract

The invention provides a method measuring contact resistance in solderless press-in connection, and aims to measure the contact resistance of two plating holes electrically connected on a printed board; the method comprises the following steps: using two pins to respectively measure a first resistance of the two pins, and adding the two first resistances so as to obtain a second resistance; measuring a third resistance between pads of the two plating holes if no pin is pressed in the two plating holes; matching the two pins with the two plating holes one by one, pressing one ends of the two pins into the plating holes, and measuring a fourth resistance between one ends, far away from the plating holes, of the two pins; using the fourth resistance to subtract the sum of the second resistance and the third resistance, and halving the difference value so as to obtain the to-be-measured contact resistance. The method can reduce the measuring errors, is higher in measuring efficiency, and more truly and reliable in measurement.

Description

technical field [0001] The invention relates to the technical field of resistance measurement, in particular to a method for measuring the contact resistance of a solderless press-in connection. Background technique [0002] In the past production of printed boards, the pins are usually welded on the pads at the plated holes. However, the printed boards made by this welding method are not conducive to the replacement of the pins, and because the replacement needs to be heated , high temperature is also easy to cause damage to the printed board. Therefore, when making printed boards at present, solderless press-in connections are often used between pins and plated holes. [0003] Solderless press-in connection technology generally requires that the contact resistance be less than 1mΩ. Therefore, in order to ensure that the product is qualified, it is necessary to detect the contact resistance of the solderless press-in connection. [0004] At present, the commonly used meth...

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Problems solved by technology

[0004] At present, the commonly used methods for measuring the contact resistance of solderless press-in connections are as follows: figure 1 shown, that is, the four-wire Kelvin grammar, given by figure 1 It can be seen that this is a direct measurement method. The disadvantage of this method is that the test leads that are in contact with the pad (located in the plated hole of the printed board 2 and in contact with the pressure pin 1) are difficult to communicate with in actual operation. figure 1 The test point indicated by the middle arrow is in correct contact with the

Because if the test leads are attached too close to the pressure pin 1, it is easy to touch the pressure pin 1, and if they are far away from the pressure pin 1, it is easy to cause the resistance of the introduced pad to be too large. In short, this method is not conducive to the actual operation, it brings inconvenience to the measurement work, the measurement efficiency is low, and the measurement error is large

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