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Exposure equipment, protection jig thereof and exposure method

A fixture and equipment technology, which is applied in the direction of microlithography exposure equipment, photolithography exposure device, etc., can solve the problems of increased production cost, reduced production efficiency, increased working time of lithography process, etc., to improve position control accuracy, The effect of improving space utilization

Inactive Publication Date: 2018-05-29
HUAIAN IMAGING DEVICE MFGR CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the additional edge photoresist coating step increases the operating time of the photolithography process, which in turn leads to reduced production efficiency and increased production costs

Method used

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  • Exposure equipment, protection jig thereof and exposure method
  • Exposure equipment, protection jig thereof and exposure method
  • Exposure equipment, protection jig thereof and exposure method

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Experimental program
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Embodiment Construction

[0027] In the existing photolithography process, due to the limitation of the production process, the uniformity of the pattern in the edge area of ​​the wafer is very poor, and the semiconductor material in the edge area is prone to problems such as irregular size and poor adhesion, and then it will fall off and float to The central region of the wafer, where defects occur.

[0028] Figure 1 to Figure 2 It is a schematic cross-sectional structure diagram of a device corresponding to each step in an exposure method in the prior art.

[0029] refer to figure 1 , provide a semiconductor substrate 100, the semiconductor substrate 100 includes a central region A region and an edge region B region, the surface of the semiconductor substrate 100 has a layer 110 to be etched, through exposure, development and other photolithography processes, in the A patterned photoresist layer 120 is formed on the surface of the layer to be etched 110 .

[0030] Further, as figure 2 As shown,...

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PUM

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Abstract

The invention relates to exposure equipment, a protection jig thereof and an exposure method. The protection jig comprises a jig main body and a fixed piece, wherein the jig main body provides a roundopening under a working state, the center of the round opening is coincided with the center of a wafer, an edge region of the wafer is shielded by the jig main body, a central region of the wafer isexposed by the jig main body, the central region is encircled by the edge region, and the fixed piece is suitably used for fixing the jig main body on a wafer base. With the protection jig disclosed by the scheme, the operation time of a photoetching process can be effectively saved, the production cost is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to an exposure equipment, a protective jig and an exposure method thereof. Background technique [0002] Semiconductor manufacturing technology requires a variety of different physical and chemical processes on semiconductor substrates. Photolithography is one of the most important processes in semiconductor manufacturing technology, and it accounts for a large proportion of the total production cost. The improvement of photolithography The production cost can be effectively reduced and the production efficiency can be improved. [0003] In the existing photolithography process, due to the limitation of the production process, the uniformity of the pattern in the edge area of ​​the wafer is very poor, and the semiconductor material in the edge area is prone to problems such as irregular size and poor adhesion, and then it will fall off and float to The central region of the w...

Claims

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Application Information

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IPC IPC(8): G03F7/20
Inventor 徐猛温建胜黄志凯叶日铨吴政达
Owner HUAIAN IMAGING DEVICE MFGR CORP