Method for detecting the alignment state of wafer in wafer conveying system

Abstract

The invention relates to a method for detecting the alignment state of a wafer in a wafer conveying system. The method includes the steps of using two sets of infrared transceivers to form a detectionsurface parallel to a base above a base positioning groove, blocking infrared rays once a wafer box is placed in a probe table, and judging that the wafer box is placed into the probe table; using the other group of infrared transceivers to form an infrared detection line perpendicular to the base edge on the base edge of the wafer box, the side surface of the whole wafer box being parallel to and close to the infrared rays after the wafer box is placed into the base and fixed, and blocking the infrared rays once the wafers in the wafer box generate displacement, so that the inclination and slipping phenomena of the wafers due to excessive displacement can be detected. The area of a probe table for placing a wafer box is modified, whether the wafer box is correctly placed can be effectively detected, and displacement of a wafer in the testing process or in the loading and releasing process can be monitored and an effective promote is sent out, so that the wafer is protected, and the production safety is maintained.

Description

technical field [0001] The invention relates to a detection technology, in particular to a detection method of a wafer alignment state in a wafer conveying system. Background technique [0002] When ICs are tested on wafers, probe stations and wafer boxes are an essential part. [0003] Before the wafer test, the wafer box containing the wafer will be placed on the probe station first, and the wafer in the wafer box will be moved to the designated test area of ​​the probe station through the operation of the probe station. At this time First of all, make sure that the wafer cassette is correctly placed in the probe station, and ensure that the wafer inside cannot be displaced. [0004] figure 1 It is a structural diagram of the area where the wafer box is placed on the existing probe station. The area where the wafer box is placed on the probe station is a cuboid area, and a closed independent space is formed by the bottom plate, the back plate and the cover that are perpe...

AI Technical Summary

Problems solved by technology

[0009] The present invention aims at the problem that the detection accuracy of the current wafer box and wafer state cannot be ensured, and proposes a detection method for the alignment state of the wafer in the wafer conveying system, which solves the problem that the integrated circuit is correct before the wafer test. Identify that the wafer cassette has been placed in the probe station, and ensure that once the displacement occurs during the wafer testing process and the wafer release process, it can be dealt with in time to prevent the wafer from slipping.

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