Memory device and method of operation thereof
A technology of memory, memory cells, used in the field of semiconductors
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[0020] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components, values, operations, materials, arrangements, etc. are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. Other components, values, operations, materials, arrangements, etc. are contemplated. For example, in the following description, forming a first component over or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which the first component and the second component are formed in direct contact. An embodiment in which an additional part is formed in between so that the first part and the second part may not be in direct contact. In addition, the present invention may repeat reference numerals and / or...
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