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Method for splicing printed board in frequency selective radome processing technology

A technology of processing technology and frequency selection, applied in the direction of antenna, radiation unit cover, electrical components, etc., can solve the problems of FSS screen performance degradation and difficulty reaching designers.

Inactive Publication Date: 2018-06-05
THE 724TH RES INST OF CHINA SHIPBUILDING IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, FSS screen splicing is widely used in the form of lap splicing or straight edge splicing, which will lead to a decline in the performance of FSS screens to a certain extent, and it is difficult to meet the requirements of designers.

Method used

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  • Method for splicing printed board in frequency selective radome processing technology
  • Method for splicing printed board in frequency selective radome processing technology

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Embodiment Construction

[0020] The present invention will be further described below by examples in conjunction with the accompanying drawings.

[0021] The method for splicing printed boards in the frequency selective radome processing process of the present invention includes the following elements:

[0022] According to the size and structure of the radome, the FSS screen is divided into various sub-modules.

[0023] Wherein, the area of ​​each sub-module should be as large as possible, and the number of sub-modules should be as small as possible, so as to reduce the number of seams. The sub-module should be producible by engineering. At present, the maximum size of the hard board processing of domestic printed boards does not exceed 1200mm.

[0024] Further, according to the size and shape of each divided sub-module, the number and arrangement position of the periodic units 1 on the module are determined.

[0025] E.g figure 2 As shown in a rectangular FSS screen sub-module, the periodic unit...

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Abstract

The invention relates to a method for splicing a printed circuit board in a frequency selective radome processing technology, which is applicable to a condition that an FSS (Frequency Selective Surface) screen required to be spliced is irregular in periodic unit and large in radome size. According to the invention, the boundaries of frequency selective surface submodules required to be spliced arecut into structurally complementary zigzag shapes according to the contour shape and the arrangement pattern of metal units, and the zigzag-shaped contour has a positioning function in splicing. Thezigzag-shaped cutting mode can also ensure that the metal periodic units are not cut off, so that the reflection caused by the discontinuity at the splicing seam is reduced. The splicing method adoptsa non-overlapping mode, the emergence of a splicing seam is allowed, and the processing precision of the printed board can be reduced, so that the processing cost can be reduced. The micro space at the splicing seam is naturally filled by an adhesive film with the dielectric constant being close to that of a printed board substrate in the recombination process of the radome, so that the product is ensured to be highly consistent with a simulation model, and electrical performance guaranteed more easily. The method is simple and good in splicing effect, and has high engineering practicability.

Description

technical field [0001] The invention belongs to the field of antenna microwaves, in particular to a method for splicing printed boards in the process of frequency selection radome processing. Background technique [0002] In the stealth technology of the radar system, the frequency selective surface (Frequency Selective Surface, FSS) technology has a very important position. FSS is a type of structure formed by periodic arrangement of the same units on a one-dimensional or two-dimensional plane. At present, the widely used processing form is printed circuit technology, which etches the desired metal pattern on the copper clad layer of the substrate. However, due to the difficulty of FSS design, complex processing technology and high cost, it has not been widely used in various weapon platforms at present. One of the reasons is that the physical size of the cover is often large. At present, the area of ​​the entire board that can be processed by domestic and foreign printed ...

Claims

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Application Information

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IPC IPC(8): H01Q1/42H01Q15/00
CPCH01Q1/42H01Q15/0013
Inventor 杨培刚
Owner THE 724TH RES INST OF CHINA SHIPBUILDING IND
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