Seal ring structure for protecting integrated circuit chip

Abstract

The invention discloses a seal ring structure for protecting an integrated circuit chip. The seal ring structure comprises a fixed substrate, a plastic body, an LED mark, an auxiliary pin, a protruding part, pins, a fixing hole, a first seal ring, a second seal ring, a dielectric layer, firm support elements, a seal ring body, an integrated circuit, a metal line, an inner side block and an opening. The seal ring structure has the beneficial effects that at least one side of the seal ring body is set into a double-sided structure, and at least one opening is formed in at least one inner side adjacent to the integrated circuit on the chip, so that penetration of moisture can be prevented, the influence of noise transmitted from the seal rings on the integrated circuit can be reduced, noise coupling can be reduced and an electromagnetic signal is prevented from interfering with operation of a sensitive circuit.

Description

technical field [0001] The invention relates to a sealing ring structure for protecting integrated circuit chips, which belongs to the field of integrated circuit chips. Background technique [0002] Integrated circuits are usually fabricated on silicon wafers or other semiconductor material substrates, then packaged and tested. When packaging, the integrated circuit must first be diced. The mechanical force of cutting can cause tiny cracks to form on the edges, especially near the corners. The formed cracks may advance toward the central circuit area of ​​the integrated circuit and cause damage to the circuit area therein. In order to protect the circuit area at the center of the integrated circuit, a sealing ring is generally arranged on the integrated circuit chip between the circuit area and its dicing line. The sealing ring can prevent any cracks (for example, cracks caused by the stress when cutting the integrated circuit from invading the circuit area inside the in...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies in the prior art, the object of the present invention is to provide a sealing ring structure for protecting integrated circuit chips, so as to solve certain risks in the reliability of the existing sealing rings, especially under some harsh environmental conditions, water vapor It can enter the interior of the integrated circuit chip through the interruption of the sealing ring to accelerate the aging of the chip, which will cause damage to the internal devices of the chip

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