A heat sink for electronic components

A technology for heat sinks and electronic components, which is applied to electrical components, structural components of electrical equipment, circuit layout on supporting structures, etc. , placed stable effect

Active Publication Date: 2019-08-09
深圳日海新能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a rapid heat dissipation device for electronic components, which has the advantages of better heat dissipation effect and can make the placement of electronic components more stable, and solves the problem that the electronic components cannot be fixed and dissipated. The effect of the general problem

Method used

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  • A heat sink for electronic components
  • A heat sink for electronic components

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see Figure 1-2 , including a housing 1, the bottom of the inner wall of the housing 1 is fixedly connected with a heat dissipation plate 31, the heat dissipation plate 31 is wave-shaped, and the bottom of the housing 1 is fixedly connected with a support column 2, the number of the support column 2 is two, two support The vertical center line of the column 2 and the shell 1 is centered symmetrically. The bottom of the support column 2 is disc-shaped, w...

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Abstract

The invention relates to the technical field of an electronic component, and discloses a rapid cooling device for an electronic component. The rapid cooling device comprises a shell, wherein a supportpost is fixedly connected with the bottom of the shell, the bottom of the shell is arranged at an inner side of the support post and is fixedly connected with a fixed support, a driving motor is fixedly arranged at an inner wall of the fixed support, an output shaft of the driving motor is fixedly connected with a rotation shaft, one end, far away from the driving motor, of the rotation shaft penetrates through the shell and extends to the shell, a rotation plate is fixedly connected with one end, arranged in the shell, of the rotation shaft, two connection posts are fixedly connected with the top of the rotation plate, the top of the rotation plate is arranged between the two connection posts and is fixedly connected with a cooling post. The cooling device for the electronic component issimple in structure and is convenient to use, a better cooling effect on the electronic component can be achieved, heat dissipation is more uniform, the heat dissipation range is wider, and the electronic component can be more stably placed.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a rapid heat dissipation device for electronic components. Background technique [0002] Electronic components are the basis of electronic products. Understanding the types, structures, and performance of commonly used electronic components and being able to correctly select them is the basis for learning and mastering electronic technology. Commonly used electronic components include: resistors, capacitors, inductors, potentiometers, transformers, etc. , As far as the installation method is concerned, it can be divided into two categories: traditional installation (also known as through-hole installation or DIP) and surface installation (also known as SMT or SMD). Triodes and diodes are called electronic devices. [0003] According to a heat dissipation device proposed in the invention CN101662919B, this invention solves the problems of difficult alignment of hole ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K5/02H05K7/02
CPCH05K5/0217H05K7/02H05K7/20145H05K7/20172H05K7/20318H05K7/2039
Inventor 张光宇梁玉燕
Owner 深圳日海新能源科技有限公司
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