A heat sink for electronic components
A technology for heat sinks and electronic components, which is applied to electrical components, structural components of electrical equipment, circuit layout on supporting structures, etc. , placed stable effect
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[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0025] see Figure 1-2 , including a housing 1, the bottom of the inner wall of the housing 1 is fixedly connected with a heat dissipation plate 31, the heat dissipation plate 31 is wave-shaped, and the bottom of the housing 1 is fixedly connected with a support column 2, the number of the support column 2 is two, two support The vertical center line of the column 2 and the shell 1 is centered symmetrically. The bottom of the support column 2 is disc-shaped, w...
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