Resin board, manufacturing method of resin board, heat insulating material unit using resin board
A technology of resin boards and insulating materials, applied in the direction of building structures, buildings, building components, etc., can solve problems such as fracture and low connection strength
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no. 1 approach
[0033] Figure 1 to Figure 8 It is a diagram showing the first embodiment. figure 1 It is a structural diagram of a resin plate having the bent portion 110. Such as figure 1 As shown, the resin plate of the present embodiment is composed of a single plate body 100 made of resin, and the bent portion 110 is formed by bending a part of the plate body 100 along the bent portion 120.
[0034] The plate body 100 is composed of resin materials such as vinyl chloride resin, PET (Polyethylene terephthalate) resin, acrylic resin, PP (Polypropylene) resin, and polycarbonate. The plate body 100 is formed in a rectangular shape with a length in the Y direction H1, a width in the X direction H2 (X direction), and a thickness (plate thickness) in the Z direction D. In addition, the shape of the plate body 100 is not particularly limited to a quadrilateral such as a rectangular shape, and may be configured to be a polygonal or circular shape, or a corrugated plate shape such as a flat plate sh...
Embodiment 1
[0066] in figure 1 In the resin board 100A shown, the following experiment was performed using a resin board with a plate body 100 having a length H1 = 340 mm, a width H2 = 280, a thickness D = 2 mm, and a position (distance) H3 = 50 mm where the bent portion 120 is formed. In addition, the resin plate of this Example 1 is made of PET resin.
[0067] The depth d1 of the high-density part 121 = 1.4mm, the depth d2 of the low-density part 122 = 2mm (the through cut part), the ratio of the density b of the high-density part 121 to the plate 100 (a / b) = 3.2 (here , The density a of the high density part is 4.5g / cm 3 , The density b of the board body 100 is 1.4g / cm 3 ), the ratio of the length A of the high-density part to the length B of the low-density part (A / B) = 1 / 3 (here, the length A of the high-density part is 10mm, and the length B of the low-density part is 30mm), relative The ratio of A_total to B_total of the total length of the bent part 120 where the high-density part 12...
Embodiment 2
[0069] in figure 1 In the resin board 100A shown, the following experiment was performed using a resin board with a plate body 100 having a length H1 = 340 mm, a width H2 = 280, a thickness D = 2 mm, and a position (distance) H3 = 50 mm where the bent portion 120 is formed. In addition, the resin plate of the second embodiment is made of vinyl chloride resin.
[0070] The depth d1 of the high-density part 121 = 1.2 mm, the depth d2 of the low-density part 122 = 0.2 mm, the ratio of the density b of the high-density part 121 to the plate 100 (a / b) = 2.5 (here, the high-density part The density a is 3.5g / cm 3 , The density b of the board body 100 is 1.4g / cm 3 ), the ratio of the length A of a high-density part to the length B of the low-density part (A / B)=3 / 2 (here, the length A of the high-density part is 30mm, and the length B of the low-density part is 20mm), relative The ratio of A_total and B_total of the total length of the bent part 120 where the high-density part 121 and th...
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