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Substrate processing apparatus and method of manufacturing semiconductor device

A substrate processing device and substrate technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, conveyor objects, etc., can solve the problems of high price and large footprint of the substrate processing device.

Inactive Publication Date: 2018-06-12
KOKUSA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since substrate processing equipment has a large footprint and is expensive, there is a limit to preparing multiple dedicated equipment

Method used

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  • Substrate processing apparatus and method of manufacturing semiconductor device
  • Substrate processing apparatus and method of manufacturing semiconductor device
  • Substrate processing apparatus and method of manufacturing semiconductor device

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Experimental program
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no. 1 approach

[0031] First, a first embodiment of the present invention will be described.

[0032] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

[0033] (substrate processing equipment)

[0034] First, use figure 1 and figure 2 The substrate processing apparatus 10 of this embodiment will be described.

[0035] figure 1 It is a transverse cross-sectional view of a cluster-type substrate processing apparatus 10 according to this embodiment. figure 2 It is a schematic longitudinal cross-sectional view of the cluster-type substrate processing apparatus 10 according to the present embodiment.

[0036] In addition, in the substrate processing apparatus 10 to which the present invention is applied, a FOUP (Front Opening Unified Pod: hereinafter referred to as a cassette) 100 is used as a carrier for transferring a wafer 200 as a substrate. The transfer device of the cluster-type substrate processing apparatus 10 according to t...

no. 2 approach

[0135] In the second embodiment, the width of the forceps for transferring the wafer 200L is configured to be smaller than the width n between the support mechanisms 311 in the horizontal direction. Other than that, it is the same as the first embodiment.

[0136] Figure 9 It is an explanatory diagram explaining the effect when the width of the forceps 112a is configured to be smaller than the width n between the support mechanisms 311 in the horizontal direction. Here, the tweezers 112a is taken as an example for description.

[0137] As a method for picking up the wafer by the tweezers 112a, there is a method of firstly making the tweezers stand by below the wafer, and then raising the tweezers. In the case of this method, it is necessary to put the tweezers on standby.

[0138] In this case, in the form of making Figure 11 In the case where such support mechanism 311 and support mechanism 321 respectively have a continuous structure, a standby space for forceps is req...

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Abstract

The invention provides a substrate processing apparatus and a method of manufacturing a semiconductor device, and the invention aims to provide a technique for performing substrate processing withoutlimitation by substrate kind. A substrate processing apparatus and technique, capable of processing substrates regardless of the types of substrates, include a loadlock chamber accommodating a first support part and a second support part for supporting a wafer; a first transfer mechanism including first tweezers configured to transfer the substrate into or out of the loadlock chamber through a first side of the loadlock chamber; a second transfer mechanism including second tweezers configured to transfer the substrate into or out of the loadlock chamber through a second side of the loadlock chamber; and a reactor where the substrate is processed. The first support part includes first support mechanisms spaced apart by a first distance along a direction perpendicular to an entering direction of the first tweezers or the second tweezers, and the second support part includes second support mechanisms spaced apart by a second distance smaller than the first distance.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, a semiconductor device manufacturing method, and a program. Background technique [0002] As one embodiment of a substrate processing apparatus used in a manufacturing process of a semiconductor device, there is, for example, an apparatus having a load lock chamber (for example, Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2001-345279 [0004] Various substrates are used in semiconductor devices. For example, there are substrates with a diameter of 200 mm and substrates with a diameter of 300 mm. In order to process the above-mentioned substrates, a dedicated device for 200 mm substrates and a dedicated device for 300 mm substrates have been developed conventionally. [0005] With the expansion of the IoT (Internet of Things: Internet of Things) market in recent years, substrate processing of many varieties is expected. However, since a substrate pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/687H01J37/18
CPCH01J37/185H01J2237/184H01L21/67742H01L21/68707C23C16/458C23C16/54H01L21/67167H01L21/6719H01L21/67201H01L21/67766H01L21/67259H01L21/6732H01L21/67739
Inventor 八幡橘高崎唯史
Owner KOKUSA ELECTRIC CO LTD