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A diamond wire cut crystalline silicon production line and its water system

A technology for diamond wire cutting and water production, which is used in manufacturing tools, stone processing equipment, work accessories, etc., can solve the problems of fluctuations in water supply quality, large peaks in drainage and water consumption, and long time consumption, so as to reduce water consumption and wastewater discharge. , the effect of reducing the rated capacity and avoiding the peak water consumption

Active Publication Date: 2020-07-10
LUOYANG CSI PHOTOVOLTAIC TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] (1) After cutting, the waste water is discharged in a centralized manner, and the peak value of water drainage and water use is too large, and the manufacturing capacity and storage capacity of recycled water must meet the peak process requirements; in the waste water discharged during the peak and idle time, the concentration of silicon powder and chemicals varies greatly, The quality of water supply fluctuates, and there are hidden dangers in use;
[0011] (2) In the middle and late stages of cutting processing, the silicon powder content of circulating water is high and easy to deposit, which makes it difficult to clean the equipment, takes a long time, and consumes a lot of water

Method used

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  • A diamond wire cut crystalline silicon production line and its water system
  • A diamond wire cut crystalline silicon production line and its water system
  • A diamond wire cut crystalline silicon production line and its water system

Examples

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Effect test

Embodiment 1

[0048] A diamond wire cutting crystalline silicon production line, the schematic structure is as follows figure 1 , including:

[0049](i) diamond wire cutting crystalline silicon unit 40, which includes at least one cutting machine, which has a cutting unit for cutting crystalline silicon, and also includes a water storage tank for storing circulating water; cutting crystalline silicon at the cutting unit During the process, the circulating water rinses the cutting seam; after the crystal silicon is cut, the circulating water continues to rinse to clean the cutting unit;

[0050] (ii) waste water collection system 10, said waste water collection system has at least one water inlet, is connected with the waste water outlet of the wire cutting machine of diamond wire cutting crystalline silicon unit 40, and the waste water that wire cutting machine produces is collected and enters the waste water collection system;

[0051] (iii) waste water treatment system 20, comprising the...

Embodiment 2

[0066] A diamond wire cutting crystalline silicon production line, the schematic structure is as follows image 3 , including:

[0067] A diamond wire cutting unit 40 consisting of at least one wire cutting machine, the wire cutting machine has a cutting unit for cutting silicon wafers, a water storage tank located on the top of the cutting unit, and a waste water recovery chamber for reclaiming the waste generated after cutting Waste water; the waste water recovery cavity is connected with the water inlet of the waste water collection system 10 through pipelines, and the water outlet of the waste water collection system 10 is connected with the waste water treatment system 20 (the structural schematic diagram of the waste water treatment system 20 and figure 2 The first waste liquid storage tank 201 of the same) is connected, and then successively connect the filter press device 202, the second waste liquid storage tank 203, the ceramic membrane filter device 204, and the th...

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Abstract

The invention relates to a water consuming method of a diamond wire cutting crystalline silicon production line. The diamond wire cutting crystalline silicon production line is provided with at leastone wire cutting machine, each wire cutting machine adopts a diamond wire saw for cutting silicon rods into silicon wafers, and circulating water coming from a water storage tank of the wire cutting machine washes a cutting part in the cutting process of the diamond wire saw; waste water after cutting part washing is collected and treated, and production water is obtained; and production water ismixed into circulating water, and circulating water is supplied to the wire cutting machine for usage. Waste water produced by the diamond wire cutting crystalline silicon production line is treated into production water, purified water is supplemented and used as circulating water to continue entering the diamond wire cutting crystalline silicon production line for cooling water and / or washing water after compositions are mixed, on the one hand, lots of water can be saved, and waste water discharging is reduced; and on the other hand, water consumption and a water discharge peak value can belowered, and the rated capacity of equipment is lowered.

Description

technical field [0001] The invention belongs to the technical field of diamond wire-cut crystalline silicon, and in particular relates to a water-water method and a water-water system for a diamond-wire-cut crystalline silicon production line. Background technique [0002] Compared with sand wire cutting, diamond wire sawing (diamond wire cutting) has significant cost advantages, mainly in terms of high cutting capacity, less environmental pollution, and less loss of silicon material in the sawing kerf. [0003] During the diamond wire saw cutting process, pure water is used to cool the saw kerf to clean and disperse the cut silicon powder. Adding cooling fluid containing dispersants, penetrating agents, etc. to pure water enhances the cleaning and dispersing effect; compared with sand wires (using polyethylene glycol dispersed silicon carbide blades for cutting), diamond wire saws have no requirements for environmental humidity in the cutting process , but due to the high ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D7/02
CPCB28D5/042B28D7/02
Inventor 王珊珊李飞龙李铖超
Owner LUOYANG CSI PHOTOVOLTAIC TECH CO LTD
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